Liquid Epoxy Resins

Our line of powerful Liquid Epoxy Resins–including Bisphenol A, Modified Bisphenol A, Bisphenol A/F, Modified Bisphenol A/F, Bisphenol F offers the reliability, protection and performance you need, backed by the local customer support Only Olin can provide, virtually anywhere in the world.

Liquid Epoxy Resins

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Product Name & Description Type

EEW Based on solids (g/eq)

Viscosity @25°C (mPa.s)

Solids Content (wt%)

Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 301

Modified liquid epoxy resin; compared with standard bisphenol A based liquid epoxy resin, similar viscosity, improved flexibility, longer pot life and anticorrosion performance; suitable for high solids (80% volume solid above) formulation.

Modified Bisphenol A Liquid Epoxy Resins 245 – 265 10,000 – 14,000 100 APAC
D.E.R.™ 3113

Extreme low viscosity resin for .crack injection and sealing

Modified Bisphenol A Liquid Epoxy Resins 178 – 197 250 – 350 100 EMEAI
D.E.R.™ 317

High viscosity, fast reacting (20% faster than D.E.R. 331) liquid epoxy resin designed for adhesive applications requiring quick gelling with amine curing agents.

Modified Bisphenol A Liquid Epoxy Resins 192 – 203 16,000 – 25,000 100 NAA
D.E.R.™ 321

Very low viscosity resin allowing large amounts of fillers. Cure rate similar to undiluted resins. Improved acid resistance can be observed. For floorings, grouting, concrete reinforcement, structural adhesives, crack injection and castings.

Modified Bisphenol A Liquid Epoxy Resins 180 – 188 500 – 700 100 EMEAI, LAA, NAA
D.E.R.™ 3212

Similar to D.E.R. 321 epoxy resin but of higher viscosity maintaining more mechanical strength.

Modified Bisphenol A Liquid Epoxy Resins 179 – 193 750 – 1,400 100 LAA, NAA
D.E.R.™ 322

Low diluent content resin combining significant viscosity reduction whilst maintaining mechanical strength properties.

Modified Bisphenol A Liquid Epoxy Resins 183 – 193 5,500 – 8,500 100 NAA
D.E.R.™ 3221

Liquid epoxy resin especially suitable for use in water borne epoxy binder systems.

Modified Bisphenol A Liquid Epoxy Resins 187 – 208 700 – 1,000 100 EMEAI
D.E.R.™ 323

Low viscosity liquid epoxy resin with reduced surface tension. Offers excellent wetting and flow. The low diluent content is the cause of the improved mechanical properties over D.E.R. 324 epoxy resin.

Modified Bisphenol A Liquid Epoxy Resins 190 – 204 1,000 – 1,200 100 NAA
D.E.R.™ 324

Offers low viscosity and low surface tension to wet the surface better, giving better adhesion and slightly lower viscosity at any given filler loading. The diluent increases pot life, flexibility (impact resistance) and acid resistance.

Modified Bisphenol A Liquid Epoxy Resins 195 – 204 600 – 800 100 APAC, EMEAI, Global, LAA, NAA
D.E.R.™ 325

Low viscosity liquid epoxy resin with reduced surface tension. Offers excellent wetting and flow. The low diluent content is the cause of the improved mechanical properties over D.E.R. 323 and D.E.R. 324 epoxy resin.

Modified Bisphenol A Liquid Epoxy Resins 185 – 206 850 – 2,800 100 NAA
D.E.R.™ 326

Low viscosity liquid epoxy resin with minimal crystallization tendency. Offers low surface tension, excellent wetting and flow.

Modified Bisphenol A Liquid Epoxy Resins 204 – 210 600 – 900 100 NAA
D.E.R.™ 3271

Very low viscosity epoxy resin designed for mineral castings in combination with e.g. D.E.H. 2112 epoxy curing agent.

Modified Bisphenol A Liquid Epoxy Resins 156 – 170 250 – 450 100 EMEAI
D.E.R.™ 3274

Bi-functional reactive diluent containing resin offering reduced viscosity whilst only affecting the mechanical and thermal properties moderately.

Modified Bisphenol A Liquid Epoxy Resins 160 – 180 1,300 – 1,500 100 EMEAI, LAA, NAA
D.E.R.™ 3282

Reactive diluent containing epoxy resin offering low viscosity, good mechanical properties as well as solvent resistance.

Modified Bisphenol A Liquid Epoxy Resins 173 – 183 900 – 1,100 100 EMEAI
D.E.R.™ 3284

Medium viscosity liquid epoxy resin with di-functional reactive diluent. Especially suited for lamination purposes where it shows excellent wetting of the fabric and gives outstanding mechanical properties.

Modified Bisphenol A Liquid Epoxy Resins 173 – 185 2,400 – 2,900 100 EMEAI
D.E.R.™ 329

Low viscosity epoxy resin with very good thermal properties, and excellent fatigue behavior. Allows fast low temperature cure, and improved solvent resistance. For use in coatings for tank-linings and solvent-free/high solids epoxy binders.

Modified Bisphenol A Liquid Epoxy Resins 145 – 155 900 – 1,300 100 EMEAI, LAA, NAA
D.E.R.™ 330

D.E.R. 330 epoxy resin is a low viscosity bisphenol A epoxy resin commonly used in composite and casting applications. D.E.R. 330 epoxy resin frequently crystallizes at room temperature; heating to 50-55°C restores the resin to liquid state. Long-term warm storage may result in slight discoloration but does not affect the resin performance.

Bisphenol A Liquid Epoxy Resins 176 – 185 7,000 – 10,000 100 EMEAI, NAA
D.E.R.™ 330-EL

Lower viscosity bisphenol-A epoxy resin with very low hydrolysable chloride content (<100 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

Bisphenol A Liquid Epoxy Resins 176 – 185 7,000 – 10,000 100 EMEAI
D.E.R.™ 331™

Industry standard bisphenol-A based liquid epoxy resin. Offers excellent mechanical, thermal and chemical resistance properties in multiple applications. Shows improved reactivity and wetting properties versus competitive alternatives.

Bisphenol A Liquid Epoxy Resins 182 – 192 11,000 – 14,000 100 APAC, EMEAI, Global, LAA, NAA
D.E.R.™ 331-EL

Standard bisphenol-A epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

Bisphenol A Liquid Epoxy Resins 182 – 192 11,000 – 14,000 100 APAC, EMEAI
D.E.R.™ 331LS

Low Sodium content reaction product of epichlorohydrin and Bisphenol A

Bisphenol A Liquid Epoxy Resins 186 – 190 11,000 – 13,500 100 NAA
D.E.R.™ 332

High purity diglycidylether ether of bisphenol A. Its high purity and low oligomer content assures uniform performance, exceptionally low viscosity and improved elevated temperature properties over standard epoxy resins. This resin grade is mainly used in electrical encapsulation applications.

Bisphenol A Liquid Epoxy Resins 171 – 175 4,000 – 6,000 100 APAC, EMEAI, NAA
D.E.R.™ 336

Standard liquid bisphenol-A epoxy resin of intermediate viscosity and equivalent weight with narrow specification limits.

Bisphenol A Liquid Epoxy Resins 181 – 185 9,400 – 11,000 100 EMEAI
D.E.R.™ 336-EL

Intermediate viscosity epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

Bisphenol A Liquid Epoxy Resins 181 – 185 9,400 – 11,000 100 EMEAI
D.E.R.™ 337

Intermediate epoxy equivalent weight semi-solid epoxy resin, mainly used in adhesives and protective coatings, or as a modifier for other epoxy resins to improve impact strength, extensibility and adhesion.

Bisphenol A Liquid Epoxy Resins 230 – 250 400 – 800 (1) 100 EMEAI
D.E.R.™ 337-DA97

Solution of D.E.R. 337 in diacetone alcohol.

Epoxy Resin Solutions 230 – 278 NA 96 – 98 NAA
D.E.R.™ 337-X80

Solution of D.E.R. 337 in xylene. The excellent resistance and physical properties for epoxy coal tar combinations and higher solids content marine coatings.

Epoxy Resin Solutions 230 – 260 500 – 1,200 79 – 81 EMEAI, NAA
D.E.R.™ 337-X90

Solution of D.E.R. 337 in xylene. Higher solids content than D.E.R. 337-X80 epoxy resin solution.

Epoxy Resin Solutions 230 – 250 5,000 – 15,000 89 – 91 NAA
D.E.R.™ 338-X90

Solution of a semi-solid epoxy resin in xylene.

Epoxy Resin Solutions 230 – 280 5,000 – 50,000 89 – 91 NAA
D.E.R.™ 3401

Low viscosity rapidly reacting Bisphenol A/F epoxy resin designed for fast-curing coatings, adhesives, and mortars. It can be used as the sole epoxy or in combination with other epoxy resins. Rapid cure, return to service, Low emissions or substance of concern content, Low viscosity, Good chemical resistance

Modified Bisphenol A/F Liquid Epoxy Resins 175 – 215 1,500 – 3,500 100 NAA
D.E.R.™ 3411

Accelerated, crystallization stable liquid epoxy resin.

Accelerated Epoxy Resins 185 – 205 4,500 – 5,500 100 EMEAI
D.E.R.™ 3412

Accelerated modified bisphenol-A/F epoxy resin of low viscosity.

Accelerated Epoxy Resins 187 – 207 850 – 1,150 100 EMEAI
D.E.R.™ 3414

Master-batch accelerated epoxy resin with a catalyst active at room temperature. Allows shorter gel and drying times in room temperature cure and fast cycling times in composites applications.

Accelerated Epoxy Resins 190 – 210 2500 – 4500 100 APAC, EMEAI
D.E.R.™ 3415

Master-batch accelerated epoxy resin with a catalyst active at temperatures of 60 °C and above. Used in composite, heat cure, applications for fast cycling times.

Accelerated Epoxy Resins 190 – 210 2500 – 4500 100 EMEAI
D.E.R.™ 351

D.E.R. 351 liquid epoxy resin is a low viscosity epoxy resin combining the performance properties of standard bisphenol A epoxy resin with the low viscosity of bisphenol F epoxy resin. The resin blend shows a low tendency to crystallization. Applications include solvent-free coatings, tank- and pipe-linings, concrete reinforcements and also floorings, adhesives, electrical insulation and filament winding.

Bisphenol A/F Liquid Epoxy Resins 169 – 181 4,500 – 6,500 100 APAC, EMEAI
D.E.R.™ 352

Higher viscosity and more economic bisphenol-A/F liquid epoxy resin. Recommended base for many modified bisphenol-A/F liquid epoxy resins.

Bisphenol A/F Liquid Epoxy Resins 172 – 181 5,700 – 7,700 100 EMEAI
D.E.R.™ 353

Low viscosity epoxy resin with very low crystallization tendency. Offers low surface tension to wet the surface better, giving better adhesion. The diluent increases pot life, flexibility (impact resistance) and acid resistance.

Modified Bisphenol A/F Liquid Epoxy Resins 190 – 200 800 – 1,000 100 APAC, LAA, NAA
D.E.R.™ 3531

Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers low viscosity and good wetting properties it is suitable for casting resin coatings and adhesives

Modified Bisphenol A/F Liquid Epoxy Resins 183 – 199 750 – 1,150 100 EMEAI
D.E.R.™ 3532

Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers very low viscosity and good wetting properties. Similar to D.E.R. 3531 in nature.

Modified Bisphenol A/F Liquid Epoxy Resins 181 – 200 500 – 900 100 EMEAI
D.E.R.™ 3533

Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers extremely low viscosity and good wetting properties. Similar to D.E.R. 3531/3532 in nature.

Modified Bisphenol A/F Liquid Epoxy Resins 187 – 200 450 – 550 100 EMEAI
D.E.R.™ 354

Unmodified bisphenol F-based epoxy resin of low viscosity. Improves crystallization resistance of other epoxy resins and gives improvement in solvent resistance. Frequently used in solvent-free coatings, floor coverings, adhesives or composite applications.

Bisphenol F Epoxy Resins 167 – 174 3,400 – 4,200 100 APAC, LAA, NAA
D.E.R.™ 3551

Low crystallization tendency modified bisphenol-A/F liquid epoxy resin. Offers excellent wetting and is recommended for floorings, mortars, grouts and adhesives.

Modified Bisphenol A/F Liquid Epoxy Resins 184 – 193 700 – 1100 100 EMEAI
D.E.R.™ 3552

Very low viscosity epoxy modified epoxy resin with fast cure and good mechanical properties. For highly fillers systems, crack injection systems or low viscous primers.

Modified Bisphenol A/F Liquid Epoxy Resins 167 – 178 400 – 600 100 EMEAI
D.E.R.™ 356

The product performance is very similar to that obtained with D.E.R. 352 Resin except that this resin will provide a more rapid cure (higher reactivity).

Bisphenol A/F Liquid Epoxy Resins 176 – 183 6,500 – 8,000 100 EMEAI
D.E.R.™ 3572

Liquid epoxy resin, modified with a di-funtional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents.

Modified Bisphenol A/F Liquid Epoxy Resins 164 – 176 600 – 900 100 EMEAI
D.E.R.™ 3581

Liquid epoxy resin, modified with a lower vapor pressure di-functional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents.

Modified Bisphenol A/F Liquid Epoxy Resins 169 – 180 900 – 1,400 100 EMEAI
D.E.R.™ 362

Chemically modified liquid epoxy resin without diluent. Offers excellent flow and high gloss coatings / floorings. This resin is used in building application above and below ground, on road and bridge construction, as well as in underwater applications.

Modified Bisphenol A Liquid Epoxy Resins 185 – 205 4,500 – 6,500 100 NAA
D.E.R.™ 3680-X90(K)

Chemically modified low molecular weight epoxy resin in xylene. Offers lower viscosity allowing higher solids contents at similar corrosion protection properties. Improves lower temperature curing.

Epoxy Resin Solutions 230 – 270 1,200 – 3,200 89 – 91 APAC, EMEAI, Global, LAA, NAA
D.E.R.™ 383

Lower viscosity bisphenol-A epoxy resin allowing the use of less diluents or more fillers in the formulation. Offers longer pot-life versus the standard resin and slightly improved resistance properties when used in heat curing (composite) applications.

Bisphenol A Liquid Epoxy Resins 176 – 183 9,000 – 10,500 100 APAC, LAA, NAA
D.E.R.™ 383-X20

Liquid reaction product of epichlorohydrin and Bisphenol A in xylene

Epoxy Resin Solutions 176 – 183 NA 19 – 21 NAA
D.E.R.™ 721

C12-C14 alkyl glycidyl ether.

285 – 310 5 – 10 100 NAA
D.E.R.™ 723

orho-Cresyl glycidyl ether

175 – 187 5 – 10 100 NAA
D.E.R.™ 731

1,4-butanediol diglycidyl ether

130 – 145 12 – 24 100 EMEAI, NAA
D.E.R.™ 734

1,6-hexanediol diglycidylether

145 – 160 10 – 30 100 EMEAI
D.E.R.™ 741

An aliphatic reactive diluent bearing on average of slightly more than two epoxy groups per molecule. Its multi-functionality allows developing systems that are fast curing at low temperatures with excellent mechanical properties.

135 – 150 100 – 200 100 EMEAI, NAA
D.E.R.™ 742

Containing on average three epoxy groups per molecule. Its higher functionality above D.E.R. 741 epoxy resin allows even better properties in most epoxy, and especially composite, applications.

110 – 130 200 – 280 100 EMEAI, NAA
DLVE 18

Low viscosity liquid epoxy resin modified with a Cycloaliphatic polyglycidyl ether for high solids coating formulations with ultra low volatile organic compound (VOC) emissions and ease of application. Excellent corrosion protection and chemical resistance. Can be cured with multiple types of curing agents (hardeners)

Low Viscosity Epoxy Resins 160 – 175 400 – 1,000 100 APAC, EMEAI, Global, LAA, NAA
DLVE 19

Low viscosity epoxy resin modified with a Cycloaliphatic polyglycidyl ether for high solids coating formulations with low volatile organic compound (VOC) emissions, excellent application, corrosion and chemical resistance. Can be cured with multiple types of curing agents (hardeners)

Low Viscosity Epoxy Resins 185 – 200 2,600 – 4,200 100 APAC, EMEAI, Global, LAA, NAA
DLVE 52

Ultra Low viscosity epoxy resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) for high solids coating formulations with low volatile organic compound (VOC) emissions, excellent application, corrosion and chemical resistance. This resin is more hydrophobic and can provide better surface wetting. Can be cured with multiple types of curing agents (hardeners)

Low Viscosity Epoxy Resins 165 – 180 350 – 550 100 APAC, EMEAI, Global, LAA, NAA
XZ 92573.00

Liquid epoxy resin for autmotive applications

Modified Bisphenol A Liquid Epoxy Resins 335  – 370 2,400 – 4,000 100 EMEAI