Liquid Epoxy Resins

Our line of powerful Liquid Epoxy Resins–including Bisphenol A, Modified Bisphenol A, Bisphenol A/F, Modified Bisphenol A/F, Bisphenol F and Flexible–offers the reliability, protection and performance you need, backed by the local customer support Only Olin can provide, virtually anywhere in the world.

Bisphenol A Epoxy Resins

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 3171

Liquid epoxy resin with minimal crystallization tendency. A general purpose liquid epoxy resin that does not contain reactive diluents, benzyl alcohol, or solvents.

187-194
14,000-18,000
NAA
D.E.R.™ 351

Bisphenol A/F epoxy resin with very low tendency to crystallize. Applications include solvent-free coatings, tank- and pipe-linings, concrete reinforcements and also floorings, adhesives, electrical insulation and filament winding.

169 – 181
4,500 – 6,500
APAC, EMEAI, NAA
D.E.R.™ 352

Higher viscosity and more economic bisphenol-A/F liquid epoxy resin. Recommended base for many modified bisphenol-A/F liquid epoxy resins.

172 – 181
5700 – 7700
EMEAI
D.E.R.™ 356

Economical bisphenol-A/F epoxy resin with enhanced reactivity.

176 – 183
6500 – 8000
EMEAI

Epoxy Resin Blend

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
AIRSTONE™ 329E/713H/717H

High Tg mold building system for wind.

EMEAI, Global
AIRSTONE™ 710E/713H/717H

Standard mold building system for wind.

EMEAI, Global
AIRSTONE™ 720E/723H/728H

Hand wet lay up for wind.

EMEAI, Global
AIRSTONE™ 760E/762H/766H

Infusion system for wind.

EMEAI, Global
AIRSTONE™ 770E/ PTA // 778H/ PTB

Adhesive system for wind.

APAC, EMEAI, Global
AIRSTONE™ 780E/ 782 H/ 786H

Infusion system for wind.

EMEAI, Global
AIRSTONE™ 880E/882H/886H

Low viscosity infusion system for wind.

EMEAI, Global
D.E.R.™ 3113

Extreme low viscosity resin for .crack injection and sealing.

178 – 197
250 – 350
EMEAI
D.E.R.™ 321

Very low viscosity resin allowing large amounts of fillers. Cure rate similar to undiluted resins. Improved acid resistance can be observed. For floorings, grouting, concrete reinforcement, structural adhesives, crack injection and castings.

180 – 188
500 – 700
EMEAI, NAA
D.E.R.™ 3271

Very low viscosity epoxy resin designed for mineral castings in combination with e.g. D.E.H. 2112 epoxy curing agent.

156 – 170
250 – 450
EMEAI
D.E.R.™ 3282

Reactive diluent containing epoxy resin offering low viscosity, good mechanical properties as well as solvent resistance.

173 – 183
900 – 1100
EMEAI

Liquid Bis F

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 3221

Liquid epoxy resin especially suitable for use in water borne epoxy binder systems.

187 – 208
700 – 1000
EMEAI
D.E.R.™ 354

Unmodified bisphenol F-based epoxy resin of low viscosity. Improves crystallization resistance of other epoxy resins and gives improvement in solvent resistance. Frequently used in solvent-free coatings, floor coverings, adhesives or composite applications.

167 – 174
3,400 – 4,200
APAC, LAA, NAA

Liquid BPA

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 330

Lower viscosity bisphenol-A epoxy resin allowing the use of less diluents or more fillers in the formulation. Offers longer pot-life versus the standard resin and slightly improved resistance properties when used in heat curing (composite) applications.

176 – 185
7,000 – 10,000
APAC, EMEAI, NAA
D.E.R.™ 330-EL

Lower viscosity bisphenol-A epoxy resin with very low hydrolysable chloride content (<100 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

176 – 185
7,000 – 10,000
EMEAI
D.E.R.™ 331

Industry standard bisphenol-A based liquid epoxy resin. Offers excellent mechanical, thermal and chemical resistance properties in multiple applications. Shows improved reactivity and wetting properties versus competitive alternatives.

182 – 192
11,000 – 14,000
APAC, EMEAI, Global, LAA, NAA
D.E.R.™ 331-EL

Standard bisphenol-A epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

182 – 192
11,000 – 14,000
APAC, EMEAI
D.E.R.™ 332

High purity diglycidylether ether of bisphenol A. Its high purity and low oligomer content assures uniform performance, exceptionally low viscosity and improved elevated temperature properties over standard epoxy resins. This resin grade is mainly used in electrical encapsulation applications.

171 – 175
4,000 – 6,000
APAC, EMEAI, NAA
D.E.R.™ 336

Standard liquid bisphenol-A epoxy resin of intermediate viscosity and equivalent weight with narrow specification limits.

181 – 185
9,400 – 11,000
EMEAI
D.E.R.™ 336-EL

Intermediate viscosity epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

181 – 185
9,400 – 11,000
EMEAI
D.E.R.™ 337

Intermediate epoxy equivalent weight semi-solid epoxy resin, mainly used in adhesives and protective coatings, or as a modifier for other epoxy resins to improve impact strength, extensibility and adhesion.

230-250
400 – 800 (1)
EMEAI, LAA, NAA
D.E.R.™ 361

Low total chlorine reaction product of epichlorohydrin and Bisphenol A.

182 – 192
11000 – 14000 cP
LAA
D.E.R.™ 383

Lower viscosity bisphenol-A epoxy resin allowing the use of less diluents or more fillers in the formulation. Offers longer pot-life versus the standard resin and slightly improved resistance properties when used in heat curing (composite) applications.

176 – 183
9,000 – 10,500
APAC, LAA, NAA
D.E.R.™ 331LS

Liquid reaction product of epichlorohydrin and Bisphenol A.

186 – 190
11000 – 13500 cP
LAA
D.E.R.™ 331LSB BULK

Low Sodium content reaction product of epichlorohydrin and Bisphenol A.

186 – 190
11000- 13500 cP
LAA
D.E.R.™ 347

Modified reaction product of epichlorohydrin and Bisphenol A.

215 – 221
11000 – 14000 cP
LAA
D.E.R.™ 383-X20

Liquid reaction product of epichlorohydrin and Bisphenol A in xylene.

176 – 183
N/A
LAA
RES COMP 333 N

A Highly Reactive Liquid Resin Intermediate of the Epichlorydrin – Bisphenol A type diluted by xylene.

192 – 198
2300 – 4600 cP
LAA

Liquid Flexible / Flexible Epoxy Resins

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 3911

Flexible hybrid epoxy resin with elongation around 200% in combination with D.E.H. 4723. Recommended for elastic intermediate layers.

374 – 416
6500 – 9500
EMEAI
D.E.R.™ 3912

D.E.R. 3912 is an aliphatic liquid epoxy resin flexibiliser for high solids or solvent-free coatings.

550 – 650
21,000 – 29,000
EMEAI
D.E.R.™ 3913

Flexible epoxy resin that offers high elongations at break at room temperature as well as at -20°C. Can be used with standard epoxy amine adduct curing agents for flooring formulations in (freezing-) cold areas.

345 – 365
7,500 – 9,500
EMEAI, NAA
D.E.R.™ 721

C12-C14 alkyl glycidyl ether.

285-310
5.0 – 10.0
EMEAI, LAA, NAA
D.E.R.™ 723

An aromatic liquid epoxy resin based on a reaction product of epichlorohydrin and ortho-cresol. Designed as modifier for other aromatic epoxy resin systems. Offers cutting power and good reactivity, and increases mechanical properties of the cured system.

175-187
5.0 – 10.0
NAA
D.E.R.™ 731

1,4-butanediol diglycidyl ether.

130-145
12.0 – 24.0
APAC, EMEAI, NAA
D.E.R.™ 732

Longer chain length polyglycol diepoxide liquid resin. Applications include coatings and adhesives for improved flexibility, elongation and impact resistance.

310-330
60 – 70
APAC, EMEAI, LAA, NAA
D.E.R.™ 732(P)

Longer chain polyglycol diepoxide liquid resin for improved flexibility, elongation and impact resistance in coatings and adhesives.

310 – 330
60 – 70
EMEAI
D.E.R.™ 734

1,6-hexanediol diglycidylether.

145-160
10.0 – 30.0
APAC, EMEAI
D.E.R.™ 736

Shorter chain polyglycol diepoxide liquid resin for improved flexibility, elongation and impact resistance in coatings and adhesives.

175-205
30-60
APAC, EMEAI, NAA
D.E.R.™ 736(P)

Shorter chain polyglycol diepoxide liquid resin for improved flexibility, elongation and impact resistance in coatings and adhesives.

175 – 205
30 – 60
D.E.R.™ 741

An aliphatic reactive diluent bearing on average of slightly more than two epoxy groups per molecule. Its multi-functionality allows developing systems that are fast curing at low temperatures, and more resistant to chemical attack and to heat than other diluted epoxy formulations.

135-150
100-200
EMEAI, NAA
D.E.R.™ 742

Containing on average three epoxy groups per molecule. Multi-functionality allows development of systems that are fast curing at low temperatures, and more resistant to chemical attack and to heat than other diluted epoxy formulations.

110-130
200-280
EMEAI, NAA
D.E.R.™ 750

Flexibilised epoxy resin suitable for civil engineering compounds (crack bridging), adhesives or for improvement of the toughness of fiber reinforced composites.

176 – 186
2,500 – 4,500
NAA
D.E.R.™ 791

Toughened epoxy resin with good cold elasticity and good curing rate.

255 – 275
28,000 – 34,000
APAC

Liquid Mod A/F

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 326

Low viscosity liquid epoxy resin with minimal crystallization tendency. Offers low surface tension, excellent wetting and flow.

204-210
600-900
NAA
D.E.R.™ 3113

Extreme low viscosity resin for .crack injection and sealing.

178 – 197
250 – 350
EMEAI
D.E.R.™ 317

High viscosity, fast reacting (20% faster than D.E.R. 331) liquid epoxy resin designed for adhesive applications requiring quick gelling with amine curing agents.

192 – 203
16,000 – 25,000
NAA
D.E.R.™ 321

Very low viscosity resin allowing large amounts of fillers. Cure rate similar to undiluted resins. Improved acid resistance can be observed. For floorings, grouting, concrete reinforcement, structural adhesives, crack injection and castings.

180 – 188
500 – 700
EMEAI, NAA
D.E.R.™ 3212

Similar to D.E.R. 321 epoxy resin but of higher viscosity maintaining more mechanical strength.

179 – 193
750 – 1,400
NAA
D.E.R.™ 322

Low diluent content resin combining significant viscosity reduction whilst maintaining mechanical strength properties.

183 – 193
5,500 – 8,500
NAA
D.E.R.™ 3221

Liquid epoxy resin especially suitable for use in water borne epoxy binder systems.

187 – 208
700 – 1000
EMEAI
D.E.R.™ 323

Low viscosity liquid epoxy resin with reduced surface tension. Offers excellent wetting and flow. The low diluent content is the cause of the improved mechanical properties over D.E.R. 324 epoxy resin.

190 – 204
1,000 – 1,200
NAA
D.E.R.™ 324

Offers low viscosity and low surface tension to wet the surface better, giving better adhesion and slightly lower viscosity at any given filler loading. The diluent increases pot life, flexibility (impact resistance) and acid resistance.

195 – 204
600 – 800
APAC, EMEAI, LAA, NAA
D.E.R.™ 325

Low viscosity liquid epoxy resin with reduced surface tension. Offers excellent wetting and flow. The low diluent content is the cause of the improved mechanical properties over D.E.R. 323 and D.E.R. 324 epoxy resin.

185 – 206
850 – 2,800
NAA
D.E.R.™ 3271

Very low viscosity epoxy resin designed for mineral castings in combination with e.g. D.E.H. 2112 epoxy curing agent.

156 – 170
250 – 450
EMEAI
D.E.R.™ 3274

Bi-functional reactive diluent containing resin offering reduced viscosity whilst only affecting the mechanical and thermal properties moderately.

160 – 180
1,300 – 1,500
EMEAI, NAA
D.E.R.™ 3282

Reactive diluent containing epoxy resin offering low viscosity, good mechanical properties as well as solvent resistance.

173 – 183
900 – 1100
EMEAI
D.E.R.™ 3284

Medium viscosity liquid epoxy resin with di-functional reactive diluent. Especially suited for lamination purposes where it shows excellent wetting of the fabric and gives outstanding mechanical properties.

173 – 185
2400 – 2900
EMEAI
D.E.R.™ 329

Low viscosity epoxy resin with very good thermal properties, and excellent fatigue behavior. Allows fast low temperature cure, and improved solvent resistance. For use in coatings for tank-linings and solvent-free/high solids epoxy binders.

145 – 155
900 – 1,300
NAA
D.E.R.™ 333

Low viscosity catalyzed epoxy resin for pre-preg applications.

192-198
2,300-4,600
NAA
D.E.R.™ 3411

Accelerated, crystallization stable liquid epoxy resin.

185 – 205
4500 – 5500
EMEAI
D.E.R.™ 3412

Accelerated modified bisphenol-A/F epoxy resin of low viscosity.

187 – 207
850 – 1150
EMEAI
D.E.R.™ 3414

Master-batch accelerated epoxy resin with a catalyst active at room temperature. Allows shorter gel and drying times in room temperature cure and fast cycling times in composites applications.

190 – 210
2500 – 4500
EMEAI
D.E.R.™ 3415

Master-batch accelerated epoxy resin with a catalyst active at temperatures of 60 °C and above. Used in composite, heat cure, applications for fast cycling times.

190 – 210
2500 – 4500
EMEAI
D.E.R.™ 346

Low viscosity catalyzed epoxy resin for pre-preg applications.

176-183
2,000-5,000
NAA
D.E.R.™ 353

Low viscosity epoxy resin with very low crystallization tendency. Offers low surface tension to wet the surface better, giving better adhesion. The diluent increases pot life, flexibility (impact resistance) and acid resistance.

190 – 200
800 – 1000
NAA
D.E.R.™ 3531

Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers low viscosity and good wetting properties it is suitable for casting resins, coatings and adhesives.

183 – 199
750 – 1150
EMEAI
D.E.R.™ 3532

Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers very low viscosity and good wetting properties. Similar to D.E.R. 3531 in nature.

181 – 200
500 – 900
EMEAI
D.E.R.™ 3533

Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers extremely low viscosity and good wetting properties. Similar to D.E.R. 3531/3532 in nature.

187 – 200
450 – 550
EMEAI
D.E.R.™ 3551

Low crystallization tendency modified bisphenol-A/F liquid epoxy resin. Offers excellent wetting and is recommended for floorings, mortars, grouts and adhesives.

184 – 193
700 – 1100
EMEAI
D.E.R.™ 3552

Very low viscosity epoxy modified epoxy resin with fast cure and good mechanical properties. For highly fillers systems, crack injection systems or low viscous primers.

167 – 178
400 – 600
EMEAI
D.E.R.™ 3572

Liquid epoxy resin, modified with a di-funtional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents.

164 – 176
600 – 900
EMEAI
D.E.R.™ 3581

Liquid epoxy resin, modified with a lower vapor pressure di-functional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents.

169 – 180
900 – 1400
EMEAI
D.E.R.™ 362

Chemically modified liquid epoxy resin without diluent. Offers excellent flow and high gloss coatings / floorings. This resin is used in building application above and below ground, on road and bridge construction, as well as in underwater applications.

185 – 205
4,500 – 6,500
NAA

Low Viscosity Epoxy Resin & Blends

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 301

Modified liquid epoxy resin designed for high solid formulation (80% volume solid above) with similar viscosity, improved flexibility, longer pot life and anticorrosion performance comparing with D.E.R.331.

245 – 265
10,000 – 14,000
APAC
D.E.R.™ 324

Offers low viscosity and low surface tension to wet the surface better, giving better adhesion and slightly lower viscosity at any given filler loading. The diluent increases pot life, flexibility (impact resistance) and acid resistance.

195 – 204
600 – 800
APAC, EMEAI, LAA, NAA
D.E.R.™ 3401

Low viscosity rapidly reacting Bisphenol A/F epoxy resin designed for fast-curing coatings, adhesives, and mortars. It can be used as the sole epoxy or in combination with other epoxy resins. Rapid cure, return to service, Low emissions or substance of concern content, Low viscosity, Good chemical resistance.

175 – 215
1,500 – 3,500
NAA
D.E.R.™ 353

Low viscosity epoxy resin with very low crystallization tendency. Offers low surface tension to wet the surface better, giving better adhesion. The diluent increases pot life, flexibility (impact resistance) and acid resistance.

190 – 200
800 – 1000
NAA
DLVE™ 18

Low viscosity liquid epoxy resin modified with a Cycloaliphatic polyglycidyl ether for high solids coating formulations with ultra low volatile organic compound (VOC) emissions and ease of application. Excellent corrosion protection and chemical resistance. Can be cured with multiple types of curing agents (hardeners).

160 – 175
400 – 1000
EMEAI, NAA
DLVE™ 19

Low viscosity epoxy resin modified with a Cycloaliphatic polyglycidyl ether for high solids coating formulations with low volatile organic compound (VOC) emissions, excellent application, corrosion and chemical resistance. Can be cured with multiple types of curing agents (hardeners).

185 – 200
2,600 – 4,200
EMEAI, NAA
DLVE™ 52

Ultra Low viscosity epoxy resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) for high solids coating formulations with low volatile organic compound (VOC) emissions, excellent application, corrosion and chemical resistance. This resin is more hydrophobic and can provide better surface wetting. Can be cured with multiple types of curing agents (hardeners).

165 – 180
350 – 550
EMEAI, NAA
DLVNE™ 59

Low viscosity Novolac resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) for high solids coating formulations with low volatile organic compound (VOC) emissions. Balance of properties similar to solvent borne Novolac.

160 – 175
2,000 – 4,000
EMEAI, NAA
DLVNE™ 60

Low viscosity Novolac resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) that facilitate high solids coating formulations with low volatile organic compound (VOC) emissions, improved application, strong chemical and thermal resistance.

166 – 176
1,100 – 1,900 (1)
EMEAI, NAA
DLVNE™ 61

Medium low viscosity Novolac resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) that facilitate high solids coating formulations with low volatile organic compound (VOC) emissions, improved application, strong chemical and thermal resistance.

155 – 170
4,500 – 6,500
EMEAI, NAA