Our line of powerful Liquid Epoxy Resins–including Bisphenol A, Modified Bisphenol A, Bisphenol A/F, Modified Bisphenol A/F, Bisphenol F offers the reliability, protection and performance you need, backed by the local customer support Only Olin can provide, virtually anywhere in the world.
| Product Name & Description | Type | EEW Based on solids (g/eq) | Viscosity @25°C (mPa.s) | Solids Content (wt%) | Regional Availability
APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India LAA - Latin America Area NAA - North America Area |
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D.E.R.® 301
Modified liquid epoxy resin; compared with standard bisphenol A based liquid epoxy resin, similar viscosity, improved flexibility, longer pot life and anticorrosion performance; suitable for high solids (80% volume solid above) formulation. |
Modified Bisphenol A Liquid Epoxy Resins | 245 – 265 | 10,000 – 14,000 | 100 | APAC | – |
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D.E.R.® 317
High viscosity, fast reacting (20% faster than D.E.R. 331) liquid epoxy resin designed for adhesive applications requiring quick gelling with amine curing agents. |
Modified Bisphenol A Liquid Epoxy Resins | 192 – 203 | 16,000 – 25,000 | 100 | NAA | – |
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D.E.R.® 321
Very low viscosity resin allowing large amounts of fillers. Cure rate similar to undiluted resins. Improved acid resistance can be observed. For floorings, grouting, concrete reinforcement, structural adhesives, crack injection and castings. |
Modified Bisphenol A Liquid Epoxy Resins | 180 – 188 | 500 – 700 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 3212
Similar to D.E.R. 321 epoxy resin but of higher viscosity maintaining more mechanical strength. |
Modified Bisphenol A Liquid Epoxy Resins | 179 – 193 | 750 – 1,400 | 100 | LAA, NAA | – |
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D.E.R.® 322
Low diluent content resin combining significant viscosity reduction whilst maintaining mechanical strength properties. |
Modified Bisphenol A Liquid Epoxy Resins | 183 – 193 | 5,500 – 8,500 | 100 | NAA | – |
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D.E.R.® 3221
Liquid epoxy resin especially suitable for use in water borne epoxy binder systems. |
Modified Bisphenol A Liquid Epoxy Resins | 187 – 208 | 700 – 1,000 | 100 | EMEAI | – |
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D.E.R.® 324
Offers low viscosity and low surface tension to wet the surface better, giving better adhesion and slightly lower viscosity at any given filler loading. The diluent increases pot life, flexibility (impact resistance) and acid resistance. |
Modified Bisphenol A Liquid Epoxy Resins | 195 – 204 | 600 – 800 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 325
Low viscosity liquid epoxy resin with reduced surface tension. Offers excellent wetting and flow. The low diluent content is the cause of the improved mechanical properties over D.E.R. 323 and D.E.R. 324 epoxy resin. |
Modified Bisphenol A Liquid Epoxy Resins | 185 – 206 | 850 – 2,800 | 100 | NAA | – |
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D.E.R.® 326
Low viscosity liquid epoxy resin with minimal crystallization tendency. Offers low surface tension, excellent wetting and flow. |
Modified Bisphenol A Liquid Epoxy Resins | 204 – 210 | 600 – 900 | 100 | NAA | – |
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D.E.R.® 327
Lower viscosity and easier to handle than D.E.R. 326 with minimal crystallization tendency. Offers low surface tension, excellent wetting and flow. |
Modified Bisphenol A Liquid Epoxy Resins | 196 – 212 | 500 – 700 | 100 | LAA, NAA | – |
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D.E.R.® 3271
Very low viscosity epoxy resin designed for mineral castings in combination with e.g. D.E.H. 2112 epoxy curing agent. |
Modified Bisphenol A Liquid Epoxy Resins | 156 – 170 | 250 – 450 | 100 | EMEAI | – |
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D.E.R.® 3274
Bi-functional reactive diluent containing resin offering reduced viscosity whilst only affecting the mechanical and thermal properties moderately. |
Modified Bisphenol A Liquid Epoxy Resins | 160 – 180 | 1,300 – 1,500 | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 3282
Reactive diluent containing epoxy resin offering low viscosity, good mechanical properties as well as solvent resistance. |
Modified Bisphenol A Liquid Epoxy Resins | 173 – 183 | 900 – 1,100 | 100 | APAC, EMEAI | – |
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D.E.R.® 330
D.E.R. 330 epoxy resin is a low viscosity bisphenol A epoxy resin commonly used in composite and casting applications. D.E.R. 330 epoxy resin frequently crystallizes at room temperature; heating to 50-55°C restores the resin to liquid state. Long-term warm storage may result in slight discoloration but does not affect the resin performance. |
Bisphenol A Liquid Epoxy Resins | 176 – 185 | 7,000 – 10,000 | 100 | APAC, EMEAI, NAA | – |
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D.E.R.® 330-EL
Lower viscosity bisphenol-A epoxy resin with very low hydrolysable chloride content (<100 ppm). Specifically suitable for electrical, electronic and encapsulation applications. |
Bisphenol A Liquid Epoxy Resins | 176 – 185 | 7,000 – 10,000 | 100 | EMEAI | – |
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D.E.R.® 331®
Industry standard bisphenol-A based liquid epoxy resin. Offers excellent mechanical, thermal and chemical resistance properties in multiple applications. Shows improved reactivity and wetting properties versus competitive alternatives. |
Bisphenol A Liquid Epoxy Resins | 182 – 192 | 11,000 – 14,000 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 331-EL
Standard bisphenol-A epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications. |
Bisphenol A Liquid Epoxy Resins | 182 – 192 | 11,000 – 14,000 | 100 | EMEAI | – |
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D.E.R.® 332
High purity diglycidylether ether of bisphenol A. Its high purity and low oligomer content assures uniform performance, exceptionally low viscosity and improved elevated temperature properties over standard epoxy resins. This resin grade is mainly used in electrical encapsulation applications. |
Bisphenol A Liquid Epoxy Resins | 171 – 175 | 4,000 – 6,000 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R. 335
D.E.R. 335 is a chemically modified liquid epoxy resin. Advantages: low viscosity, lower tendency to crystallize. Use in civil engineering applications such as concrete bonding, repair, protection, adhesives and solvent-less metal and mineral coatings |
Modified Bisphenol A/F Liquid Epoxy Resins | 190-210 | 4000-6000 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 336
Standard liquid bisphenol-A epoxy resin of intermediate viscosity and equivalent weight with narrow specification limits. |
Bisphenol A Liquid Epoxy Resins | 181 – 185 | 9,400 – 11,000 | 100 | EMEAI | – |
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D.E.R.® 336-EL
Intermediate viscosity epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications. |
Bisphenol A Liquid Epoxy Resins | 181 – 185 | 9,400 – 11,000 | 100 | EMEAI | – |
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D.E.R.® 337
Intermediate epoxy equivalent weight semi-solid epoxy resin, mainly used in adhesives and protective coatings, or as a modifier for other epoxy resins to improve impact strength, extensibility and adhesion. |
Bisphenol A Liquid Epoxy Resins | 230 – 250 | 400 – 800 (1) | 100 | APAC, EMEAI, NAA | (1) 70 wt% in diethylene glycol monobutyl ether |
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D.E.R.® 337-DA97
Solution of D.E.R. 337 in diacetone alcohol. |
Epoxy Resin Solutions | 230 – 278 | NA | 96 – 98 | NAA | – |
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D.E.R.® 337-X80
Solution of D.E.R. 337 in xylene. The excellent resistance and physical properties for epoxy coal tar combinations and higher solids content marine coatings. |
Epoxy Resin Solutions | 230 – 260 | 500 – 1,200 | 79 – 81 | APAC, EMEAI, NAA | – |
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D.E.R.® 337-X90
Solution of D.E.R. 337 in xylene. Higher solids content than D.E.R. 337-X80 epoxy resin solution. |
Epoxy Resin Solutions | 230 – 250 | 5,000 – 15,000 | 89 – 91 | APAC, NAA | – |
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D.E.R.® 338-X90
Solution of a semi-solid epoxy resin in xylene. |
Epoxy Resin Solutions | 230 – 280 | 5,000 – 50,000 | 89 – 91 | NAA | – |
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D.E.R.® 3401
Low viscosity rapidly reacting Bisphenol A/F epoxy resin designed for fast-curing coatings, adhesives, and mortars. It can be used as the sole epoxy or in combination with other epoxy resins. Rapid cure, return to service, Low emissions or substance of concern content, Low viscosity, Good chemical resistance |
Modified Bisphenol A/F Liquid Epoxy Resins | 175 – 215 | 1,500 – 3,500 | 100 | NAA | – |
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D.E.R.® 3411
Accelerated, crystallization stable liquid epoxy resin. |
Accelerated Epoxy Resins | 185 – 205 | 4,500 – 5,500 | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 350
D.E.R. 350 is a bisphenol F epoxy resin that has a low tendency to crystallize. |
Modified Bisphenol A/F Liquid Epoxy Resins | 165 – 174 | 2500 – 4500 | 100 | APAC, LAA, NAA | – |
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D.E.R.® 351
D.E.R. 351 liquid epoxy resin is a low viscosity epoxy resin combining the performance properties of standard bisphenol A epoxy resin with the low viscosity of bisphenol F epoxy resin. The resin blend shows a low tendency to crystallization. Applications include solvent-free coatings, tank- and pipe-linings, concrete reinforcements and also floorings, adhesives, electrical insulation and filament winding. |
Modified Bisphenol A/F Liquid Epoxy Resins | 169 – 181 | 1500 – 6500 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 352
Higher viscosity and more economic bisphenol-A/F liquid epoxy resin. Recommended base for many modified bisphenol-A/F liquid epoxy resins. |
Bisphenol A/F Liquid Epoxy Resins | 172 – 181 | 5,700 – 7,700 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 353
Low viscosity epoxy resin with very low crystallization tendency. Offers low surface tension to wet the surface better, giving better adhesion. The diluent increases pot life, flexibility (impact resistance) and acid resistance. |
Modified Bisphenol A/F Liquid Epoxy Resins | 190 – 200 | 800 – 1,000 | 100 | APAC, LAA, NAA | – |
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D.E.R.® 3531
Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers low viscosity and good wetting properties it is suitable for casting resin coatings and adhesives |
Modified Bisphenol A/F Liquid Epoxy Resins | 183 – 199 | 750 – 1,150 | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 3532
Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers very low viscosity and good wetting properties. Similar to D.E.R. 3531 in nature. |
Modified Bisphenol A/F Liquid Epoxy Resins | 181 – 200 | 500 – 900 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 3533
Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers extremely low viscosity and good wetting properties. Similar to D.E.R. 3531/3532 in nature. |
Modified Bisphenol A/F Liquid Epoxy Resins | 187 – 200 | 450 – 550 | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 354
Unmodified bisphenol F-based epoxy resin of low viscosity. Improves crystallization resistance of other epoxy resins and gives improvement in solvent resistance. Frequently used in solvent-free coatings, floor coverings, adhesives or composite applications. |
Bisphenol F Epoxy Resins | 167 – 174 | 3,400 – 4,200 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 354LV
D.E.R. 354LV Liquid Epoxy Resin is an unmodified bisphenol F based liquid, low viscosity epoxy resin. It is compatible with common epoxy resins and can be blended with them in any ratio. It achieves a high degree of cure at ambient temperatures, providing improved resistance performance against solvents compared to standard bisphenol A liquid epoxy resins. |
Bisphenol F Epoxy Resins | 158 – 170 | 1300 – 3000 | 100 | LAA, NAA | – |
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D.E.R.® 356
The product performance is very similar to that obtained with D.E.R. 352 Resin except that this resin will provide a more rapid cure (higher reactivity). |
Bisphenol A/F Liquid Epoxy Resins | 176 – 183 | 6,500 – 8,000 | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 3572
Liquid epoxy resin, modified with a di-funtional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents. |
Modified Bisphenol A/F Liquid Epoxy Resins | 164 – 176 | 600 – 900 | 100 | APAC, EMEAI | – |
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D.E.R.® 3581
Liquid epoxy resin, modified with a lower vapor pressure di-functional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents. |
Modified Bisphenol A/F Liquid Epoxy Resins | 169 – 180 | 900 – 1,400 | 100 | APAC, EMEAI | – |
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D.E.R.® 3600
D.E.R. 3600 is a formulated epoxy resin intended for use in 2K epoxy systems for applications such as manhole repair. The filler package in D.E.R. 3600 provides excellent sag resistance when the system is applied to a vertical concrete surface. |
– | 190 – 200 | 30000 – 50000 | 100 | NAA | – |
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D.E.R.® 3680-X90(K)
Chemically modified low molecular weight epoxy resin in xylene. Offers lower viscosity allowing higher solids contents at similar corrosion protection properties. Improves lower temperature curing. |
Epoxy Resin Solutions | 230 – 270 | 1,200 – 3,200 | 89 – 91 | APAC, EMEAI, LAA | – |
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D.E.R.® 383
Lower viscosity bisphenol-A epoxy resin allowing the use of less diluents or more fillers in the formulation. Offers longer pot-life versus the standard resin and slightly improved resistance properties when used in heat curing (composite) applications. |
Bisphenol A Liquid Epoxy Resins | 176 – 183 | 9,000 – 10,500 | 100 | APAC, LAA, NAA | – |
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D.E.R.® 383-X20
Liquid reaction product of epichlorohydrin and Bisphenol A in xylene |
Epoxy Resin Solutions | 176 – 183 | NA | 19 – 21 | NAA | – |
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D.E.R.® 3911A
D.E.R. 3911A is a hybrid resin based on bisphenol A epoxy resin and a urethane resin. D.E.R. 3911A provides about 200% elongation at break when used with D.E.H. 4723 Epoxy Curing Agent. Applications include elastic intermediate layers. |
– | 374 – 416 | 6500 – 9500 | 100 | NAA | – |
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D.E.R.® 3914
D.E.R. 3914 is a modified bisphenol A epoxy resin that has flexibility and elongation that is intermediate between D.E.R. 3911A and D.E.R. 324. D.E.R. 3914 can be used in flexible membranes and casting applications that require good flexural properties. |
– | 240 – 265 | 1100 – 1600 | 100 | NAA | – |
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DLVE® 18
Ultra Low viscosity liquid epoxy resin modified with a Cycloaliphatic polyglycidyl ether for high solids coating formulations with ultra low volatile organic compound (VOC) emissions and ease of application. Excellent corrosion protection and chemical resistance. Can be cured with multiple types of curing agents (hardeners) |
Ultra Low Viscosity Epoxy Resins | 160 – 175 | 400 – 1,000 | 100 | APAC, EMEAI, LAA, NAA | – |
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DLVE® 52
Ultra Low viscosity epoxy resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) for high solids coating formulations with low volatile organic compound (VOC) emissions, excellent application, corrosion and chemical resistance. This resin is more hydrophobic and can provide better surface wetting. Can be cured with multiple types of curing agents (hardeners) |
Ultra Low Viscosity Epoxy Resins | 165 – 180 | 350 – 550 | 100 | APAC, EMEAI, LAA, NAA | – |
