Flame Retardant Systems

Our line of Flame Retardant Systems offers the reliability, protection and performance you need, backed by the local customer support Only Olin can provide, virtually anywhere in the world.

Flame Retardant Systems

View Products
Product Name & Description Type

EEW Based on solids (g/eq)

Viscosity @25°C (mPa.s)

Softening Point

Solids Content (wt%)

Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.R.™ 530-A80

Standard brominated epoxy resin in acetone with about 20.5 % bromine on solids.

Brominated Epoxy Resin Solution 425 – 440 1,500 – 2,500 79 – 81 EMEAI, NAA
D.E.R.™ 537 PMK 70

Standard brominated epoxy resin in Dowanol PM and MEK with about 20 % bromine on solids.

Brominated Epoxy Resin Solution 440 – 500 100 – 1,000 69 – 71 EMEAI, NAA
D.E.R.™ 538-A80

Brominated epoxy resin in acetone with about 20% bromine on solids. Offers less flow during lamination versus D.E.R. 530-A80 epoxy resin.

Brominated Epoxy Resin Solution 465 – 495 800 – 1,800 79 – 81 NAA
D.E.R.™ 539-A80

Standard brominated epoxy resin in acetone having UV blocking properties.

Brominated Epoxy Resin Solution 430 – 470 1,000 – 1600 79 – 81 NAA
D.E.R.™ 539-EK80

Brominated epoxy resin in methyl ethyl ketone with about 20% bromine on solids. Offers enhanced UV-blocking and fluorescence.

Brominated Epoxy Resin Solution 430 – 470 1,500 – 2,000 79 – 81 EMEAI
D.E.R.™ 542

Solid epoxy resin with approximately 48% bromine for flame retardancy

Brominated Epoxy Resins 305 – 355 NA 52 – 62 100 APAC, EMEAI, Global, LAA, NAA
D.E.R.™ 560

Higher molecular weight solid epoxy resin with approximately 48% bromine for flame retardancy. Gives improved flexibility

Brominated Epoxy Resins 440 – 470 140 – 215 (1) 78 – 85 100 APAC, EMEAI, NAA
D.E.R.™ 592-A80

Brominated epoxy resin in acetone with about 17% bromine on solids. Offers best dimensional stability and better chemical resistance that standard resins.

Brominated Epoxy Resin Solution 350 – 370 1,000 – 2,400 79 – 81 EMEAI, NAA
D.E.R.™ 593

Brominated epoxy resin in DOWANOL™ PM glycol ether with about 17 wt% bromine on solids. Allows quicker cure and higher Tg due to the large amount of catalyst that can be added.

Brominated Epoxy Resin Solution 350 – 370 400 – 1,100 74 – 76 EMEAI, NAA
Prologic BF 150H (XZ 92749.00)

Phosphorous containing phenolic hardener for halogen-free electrical laminate applications recommended for use with specialty epoxy resins XZ 92748.00 or XZ 92757.00.

Halogen-free Phenolic Curing Agent NA 200 – 1,000 45 – 55 NAA
Prologic BF 150R (XZ 92748.00)

Epoxy novolac resin solution, suitable for mid – high Tg halogen free electrical laminates.

Halogen-free Epoxy Resin Solution 176 – 181 NA 84-86 NAA
XZ 92566.00

Flow modifier supplied in non-toxic cyclohexanone. Designed to reduce flow in the production of FR-4 type rigid board and multilayer electrical laminates. Especially formulated to have enhanced flow control without negatively impacting the glass transition temperature.

Halogen-free Epoxy Resin Solution 825 – 1,000 3,000 – 9,000 49 – 51 NAA
XZ 92757.00

High functional bisphenol A epoxy novolac solution in MEK at 75% solid useful for high Tg composites and electrical laminate applications

Halogen-free Epoxy Resin Solution 195 – 210 500 – 4,000 74 – 76 NAA