Curing Agents

Our line of Curing Agents—including low temperature and low emission formulations–offers the reliability, protection and performance you need, backed by the local customer support Only Olin can provide, virtually anywhere in the world.

Amine Hardener Blends

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Product Name & Description Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
AIRSTONE™ 329E/713H/717H

High Tg mold building system for wind.

EMEAI, Global
AIRSTONE™ 710E/713H/717H

Standard mold building system for wind.

EMEAI, Global
AIRSTONE™ 720E/723H/728H

Hand wet lay up for wind.

EMEAI, Global
AIRSTONE™ 760E/762H/766H

Infusion system for wind.

EMEAI, Global
AIRSTONE™ 770E/ PTA // 778H/ PTB

Adhesive system for wind.

APAC, EMEAI, Global
AIRSTONE™ 780E/ 782 H/ 786H

Infusion system for wind.

EMEAI, Global
AIRSTONE™ 880E/882H/886H

Low viscosity infusion system for wind.

EMEAI, Global

Low Emission Curing Agents

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Product Name & Description AHEW Based on solids (g/eg) Viscosity @25°C (mPa.s) Pot Life Min. Ref. Resin Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 1911

Low emission curing agent particularly suited for the development of primers whenever the substrate is wet or difficult to adhere to.

115
1100 – 1700
70
D.E.R. 3531
EMEAI
D.E.H.™ 2920

Low emission curing agent. Offers a long working time (long pot-life) and a quick Shore D hardness development.

76
40 – 120
50
D.E.R. 3531
D.E.H.™ 2955

Offers very rapid curing and is highly suitable for anchoring systems or as accelerator. Suitable for primers if curing is required at temperatures down to -5°C.

82
1,400 – 1,700
6
D.E.R. 3581
EMEAI
D.E.H.™ 4909

Free of benzyl alcohol, nonyl phenol, Bisphenol A and any inert volatile compounds for low-emission flooring systems. Excellent wetting, long pot-life and quick tack-free time.

83
180 – 280
60
D.E.R. 3531
NAA
D.E.H.™ 4911

Fully reactive curing agent containing no VOC and no alkyl phenol. Good mechanical properties.

82
360 – 460
50
D.E.R. 3531
D.E.H.™ 4914

Excellent corrosions resistance and impact resistance for wet-paints on metallic substrates.

108
8,000 – 10,000
45
D.E.R. 331
EMEAI
D.E.H.™ 804

Aqueous polyamine adduct solution with emulsification capability. Offers visible end of pot life, fast drying, low odor. Suitable for thick layer self leveling applications.

123
5,000 – 11,000
APAC, EMEAI, NAA
D.E.H.™ 805

Aqueous polyamine adduct solution with emulsification capability. Offers visible end of pot life, low odor, fast drying and through hardening.

143
10000 – 18500
APAC, EMEAI, NAA

Low Temperature Curing Agents

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Product Name & Description AHEW Based on solids (g/eg) Viscosity @25°C (mPa.s) Pot Life Min. Ref. Resin Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 611

Medium viscosity modified aliphatic amine curing agent with very fast set time and good low temperature cure. May be used as accelerator for other amine based curing agents.

91
1,500-4,000
NAA
D.E.H.™ 613

Shorter pot-life version of D.E.H. 614 curing agent.

90
900 – 1,300
10
D.E.R. 331
APAC, NAA
D.E.H.™ 614

Solvent-free, Mannich base curing agent curing down to about 0 °C. High water and chemical resistance.

85
450 – 750
15
D.E.R. 331
EMEAI, NAA
D.E.H.™ 615

Low viscosity version of D.E.H. 614 curing agent. Over-coatable after 4 hours (industrial coatings).

75
400 – 500
15
D.E.R. 331
APAC, EMEAI, NAA
D.E.H.™ 616

Good cure rate above 0 °C and high water resistance.

75
400 – 600
15
D.E.R. 331
D.E.H.™ 619

VOC-free, modified Mannich base curing agent for improved chemical resistance.

92
820 – 1,200
52
D.E.R. 3261
D.E.H.™ 622

Modified amine curing agent with extreme high reactivity. Cures down to -5 °C.

60
490 – 690
6
D.E.R. 331
APAC, EMEAI, NAA
D.E.H.™ 630

Highly reactive (non-Mannich base) curing agent with an improved EH&S profile, better chemical resistance and UV-stability over traditional Mannich base curing agents.

73
700 – 900
14
D.E.R. 3531
EMEAI, NAA

Modified Amine Curing Agents

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Product Name & Description AHEW Based on solids (g/eg) Viscosity @25°C (mPa.s) Pot Life Min. Ref. Resin Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 20

Short pot-life curing agent on basis of diethylenetriamine (DETA).

21
4 – 8
25
D.E.R. 331
NAA
D.E.H.™ 2102

Recommended for mineral castings or heavy-filled mortars. Offers low exothermic reaction and give high heat resistance.

41
8 – 18
125
D.E.R. 3272
EMEAI
D.E.H.™ 2112

Recommended system, with D.E.R. 3271 epoxy resin for mineral castings or heavy-filled mortars. Offers low exotherm and give high heat resistance.

45
8 – 18
26
D.E.R. 3271
EMEAI
D.E.H.™ 2122

Recommended for mineral castings or heavy-filled mortars. Offers low exothermic reaction and give high heat resistance.

45
15 – 35
110
D.E.R. 3271
D.E.H.™ 2132

Very slow, low exotherm curing agent for mineral castings, composites and highly filler mortars.

45
5 – 25
>120
D.E.R. 331
EMEAI
D.E.H.™ 24

Short pot-life curing agent on basis of triethylenetetramine (TETA).

24
19.5 – 22.5
25
D.E.R. 331
NAA
D.E.H.™ 2450

Fast curing for crack-injection systems D.E.R. 3113 epoxy resin.

58
13 – 23
30
D.E.R. 3113
EMEAI
D.E.H.™ 2497

Low viscosity and offers long pot life. It is used as a blending curing agent.

76
30 – 100
100
D.E.R. 331
EMEAI, NAA
D.E.H.™ 26

Similar to D.E.H. 24 Epoxy Curing Agent in application, it provides lower vapor hazard to workers due to its higher boiling point.

27
50 – 60
27
D.E.R. 331
NAA
D.E.H.™ 262

Low viscosity, alkyl phenol-free curing agent for highly filled mortars, coatings and screeds.

87
30 – 70
25
D.E.R. 331
EMEAI
D.E.H.™ 2720

Fast cure down to 5 °C without presence of Benzyl alcohol or alkyl-phenols. Excellent adhesion and flexibility.

190
3,000 – 4,200
10
D.E.R. 331
EMEAI, NAA
D.E.H.™ 29

Economical mixture of linear, branched, and cyclic ethylene amines that offers higher flexibility and peel strength in applications where color is not a limitation.

29
200 – 300
24
D.E.R. 331
NAA
D.E.H.™ 39

Fast curing amine hardener based on amino-ethyl piperazine. Mostly used as accelerator for other curing agent.

43
10 – 15
27
D.E.R. 331
NAA
D.E.H.™ 4913

Modifies cycloaliphatic amine epoxy curing agent.

93
320 – 520
EMEAI
D.E.H.™ 505

Very fast curing agent that provides rapid development of properties. Accelerator for other amine curing agents.

95
3000 – 4000
6
D.E.R. 331
NAA
D.E.H.™ 508

Reactive low viscous curing gent with good chemical resistance and high strength.

34
100 – 300
12
D.E.R. 331
NAA
D.E.H.™ 512

Fast low viscosity curing agent with good flexibility and blush resistance.

86
150 – 350
9
D.E.R. 331
NAA
D.E.H.™ 517

Low viscosity aliphatic amine adduct with high strength and modulus and provides good heat and chemical resistance. It has wide variety of applications in adhesives, trowelable flooring, mortars, grouts and patching compounds.

31
50 – 150
NAA
D.E.H.™ 55

Medium viscosity, room-temperature, accelerated curing agent that is good for systems requiring low color.

40 – 42
1,000 – 1,700
11
D.E.R. 331
NAA
D.E.H.™ 561

Low viscosity, low temperature curing agent for blush-free products with good water spot resistance and excellent chemical resistance to acids and solvents.

85
40  – 100
17
D.E.R. 331
NAA
D.E.H.™ 58

Room-temperature, low viscosity curing agent that is extremely reactive with liquid epoxy resins.

28 – 32
85 – 130
15
D.E.R. 331
NAA
D.E.H.™ 580

Low viscosity curing agent for applications requiring self-leveling with chemical, blushing and water spot resistance.

112
300-400
NAA
D.E.H.™ 584

Light color, moisture-insensitive curing agent with good color stability and long pot life for high gloss, blush-free, impact-resistant coatings.

86
30  – 60
150
D.E.R. 331
NAA
D.E.H.™ 585

Light color, moisture-insensitive curing agent with good color stability and long pot life for high gloss, blush-free, impact-resistant coatings.

91
150 – 250
77
D.E.R. 331
NAA
D.E.H.™ 598B

Rapid-set, low temperature curing agent with good water spot and chemical resistance for high gloss, blush-free, high strength coatings.

75
50 – 200
16
D.E.R. 331
D.E.H.™ 623

Designed for high temperature service application with potential glass transition temperature of 150 °C.

46
150-250
NAA
D.E.H.™ 650

Aromatic amine suitable for curing liquid epoxy resins at elevated temperatures. Able to achieve glass transition temperature of 196 °C.

46
300-400
EMEAI
D.E.H.™ 598B

Rapid-set, low temperature curing agent with good water spot and chemical resistance for high gloss, blush-free, high strength coatings.

75
50-200
NAA

Modified Epoxy Amine Adducts

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Product Name & Description AHEW Based on solids (g/eg) Viscosity @25°C (mPa.s) Pot Life Min. Ref. Resin Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 4042

Good color stability and high acid and solvent resistance, excellent early water spot resistance and offers very long pot life.

100
100  – 200
60
D.E.R. 331
NAA
D.E.H.™ 4043

offer good color and light stability, as well as tack-free surfaces and an excellent early water resistance. D.E.H. 4702 has similar performance properties but is nonyl phenol free.

115
290 – 450
40
D.E.R. 331
EMEAI
D.E.H.™ 4044

Outstanding acid- and solvent resistance and good color and UV resistance. Gives tack-free surfaces and has excellent early water resistance.

115
600 – 900
25
D.E.R. 331
NAA
D.E.H.™ 4060

Offer best in class chemical resistance in combination with food contact compliance.

122
5,000 – 7,000
30
D.E.R. 331
EMEAI
D.E.H.™ 4129

For high quality coatings and flooring with good UV stability, mechanical properties and increased impact resistance.

108
700 – 1000
20
D.E.R. 331
D.E.H.™ 4147

Offer very good UV-stability with only a low tendency to yellowing. Especially suitable for color quartz and paints.

75
150 – 300
30
D.E.R. 331
EMEAI
D.E.H.™ 4353

Universal curing agent offering a long pot life and is suitable for adhesives, highly filled coating systems, mortars and screeds. D.E.H. 487 is a nonyl-phenol-free version.

93
80 – 180
50
D.E.R. 331
EMEAI
D.E.H.™ 4354

Universal curing agent offering a faster reactivity. D.E.H. 488 and D.E.H. 489 are equivalent nonyl-phenol-free versions.

95
150 – 350
25
D.E.R. 331
EMEAI
D.E.H.™ 444

Longer pot-life curing agent with good UV stability.

93
160 – 220
105
D.E.R. 331
EMEAI, LAA, NAA
D.E.H.™ 445

Low viscosity curing agent with good UV stability and overall mechanical & chemical resistance properties

105
370  – 570
45
D.E.R. 331
EMEAI, LAA, NAA
D.E.H.™ 4702

Excellent early water-spot resistance combined with high acid and solvent resistance.

115
370 – 470
40
D.E.R. 331
APAC, EMEAI
D.E.H.™ 4712

Offers systems with good UV-stability and is therefore suitable for paints and coatings as well as floorings

87
1,600 – 2,400
20
D.E.R. 3581
EMEAI
D.E.H.™ 4723

Recommended for elastic intermediate layers, especially when used in combination with D.E.R. 3911. It provides very high flexibility with elongation at break around 200%.

120
750 – 1150
55
D.E.R. 3911
EMEAI
D.E.H.™ 487

Longer pot-life version of D.E.H. 488 curing agent.

93
170  – 270
41
D.E.R. 331
EMEAI, LAA, NAA
D.E.H.™ 488

Low viscosity, curing agent for liquid epoxy resins. Good blush resistance and general chemical resistance.

93
280 – 380
25
D.E.R. 331
EMEAI, LAA, NAA
D.E.H.™ 489

Accelerated version of D.E.H. 488 curing agent.

93
210 – 290
20
D.E.R. 331
EMEAI
D.E.H.™ 502

Viscous, low temperature curing agent with good solvent and chemical resistance.

44
2,500 – 4,000
14
D.E.R. 331
NAA
D.E.H.™ 52

Viscous, room temperature curing agent that has a short pot life and convenient handling and mixing rates with liquid epoxy resins.

42 – 47
5,000 – 7,500
18
D.E.R. 331
NAA
D.E.H.™ 530

Rapid set, low temperature curing agent for high gloss, blush-free products with good mechanical, chemical and water spot resistance.

112
300  – 400
43
D.E.R. 331
NAA
D.E.H.™ 530 E32

Rapid set, low temperature curing agent for applications requiring good color stability and resistance to blushing and water spotting.

112
400 – 600
46
D.E.R. 331
NAA
D.E.H.™ 534

Rapid set, low temperature curing agent offering good corrosion protection and water spot resistance.

120
500 – 1,000
18
D.E.R. 331
NAA
D.E.H.™ 536

Low viscosity, low temperature curing agent for applications requiring high gloss and good color stability.

116
750 – 1,250
14
D.E.R. 331
NAA
D.E.H.™ 546

Very low viscosity curing agent for applications requiring low color, excellent color stability, and rapid-set at low temperatures.

95
200 – 400
25
D.E.R. 331
NAA
D.E.H.™ 554

Low viscosity curing agent for applications requiring self-leveling with chemical, blushing and water spot resistance.

86
60 – 80
38
D.E.R. 331
NAA
D.E.H.™ 581

Low viscosity, low temperature curing agent for products with good color and light stability.

95
250 – 600
9
D.E.R. 331
NAA
D.E.H.™ 582

Low viscosity curing agent for non-blushing products with good impact resistance and high gloss.

102
250 – 600
22
D.E.R. 331
NAA
D.E.H.™ 583

Low viscosity, low temperature curing agent for blush-free products with good water spot resistance and excellent chemical resistance.

95
250 – 600
37
D.E.R. 331
NAA
D.E.H.™ 586

Very fast ambient and low temperature curing agent for non-blushing products with good water spot resistance, excellent chemical resistance, high gloss and high strength.

86
30 – 60
45
D.E.R. 331
NAA
D.E.H.™ 589

Low viscosity, low temperature curing agent for products with good color and light stability.

83
50  – 100
22
D.E.R. 331
NAA
D.E.H.™ 595

Very fast ambient and low temperature curing agent for non-blushing products with good water spot resistance, excellent chemical resistance, high gloss and high strength.

75
1,000 – 1,500
16
D.E.R. 331
NAA

Modified Polyamide Curing Agents

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Product Name & Description AHEW Based on solids (g/eg) Viscosity @25°C (mPa.s) Pot Life Min. Ref. Resin Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 1450

Excellent adhesion on critical (badly prepared or wet/humid) substrates. Contains Alkyl phenol.

115
600 – 1,400
60
D.E.R. 331
EMEAI, LAA
D.E.H.™ 1501

Formulated Polyamide for washable tile-grouts.

63
70 – 170
70
D.E.R. 331
EMEAI
D.E.H.™ 1911

Low emission curing agent particularly suited for the development of primers whenever the substrate is wet or difficult to adhere to.

115
1100 – 1700
70
D.E.R. 3531
EMEAI
D.E.H.™ 545

Polyamide curing agent offering excellent adhesion onto highly humid or wet substrates. Good corrosion protection and low viscosity.

115
400 – 650
39
D.E.R. 331
LAA, NAA

Powder Curing Agent

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Product Name & Description OHEW (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 80

Phenolic hardener containing curing catalyst and polyacrylate flow modifier of moderate reactivity. Phenolic curing agents offer excellent chemical and moisture/water resistance and improved flexibility compared to i.e. Dicyandiamide curing agents.

245 – 275
APAC, EMEAI
D.E.H.™ 81

Phenolic curing agent of intermediate reactivity containing curing catalyst as well as a polyacrylate flow modifier. The intermediate reactivity makes D.E.H. 81 particularly suitable as starting base for product development.

240 – 270
APAC, EMEAI, NAA
D.E.H.™ 82

High reactivity phenolic curing agent containing curing catalyst as well as a polyacrylate flow modifier. Can be formulated in low application temperature applications in combination with D.E.R. 6615 solid epoxy resin.

235 – 265
APAC, EMEAI, LAA, NAA
D.E.H.™ 84

Phenolic curing agent of intermediate reactivity containing only curing catalyst. The lack of flow modifier allows formulation with alternative additives that could potentially cause compatibility problems.

240 – 270
APAC, EMEAI, LAA, NAA
D.E.H.™ 85

Unmodified phenolic curing agent particularly suitable for optimizing the reactivity of hardeners such as D.E.H. 81, D.E.H. 82 or D.E.H. 84 phenolic curing agent.

250 – 280
APAC, EMEAI, LAA, NAA
D.E.H.™ 87

Unmodified higher molecular weight phenolic curing agent providing improved flexibility and good storage stability.

370 – 400
APAC, EMEAI, LAA, NAA
D.E.H.™ 90

Phenolic curing agent for fast cure combined with superior adhesion under humid conditions. Suitable also for low application temperature applications in combination with D.E.R. 6615 solid epoxy resin.

240 – 270
APAC, EMEAI, NAA

Epoxy Toughening Agents & Toughening Resins

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Product Name & Description EEW Based on solids (g/eq) Viscosity @25°C (mPa.s) Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
D.E.H.™ 125

Standard polyamide. Excellent adhesion to various substrates. Recommended for anticorrosion coatings, concrete primer and adhesives.

8,000 – 12,0001
APAC
D.E.H.™ 140

Standard polyamide. Lower viscosity, higher chemical resistance, excellent adhesion to various substrates, good balance in performances. Recommended for adhesives and anticorrosion coatings.

10,000 – 20,000
APAC
D.E.H.™ 35

It is a tertiary amine based accelerator.

100 – 300 (77°C)
EMEAI
D.E.H.™ 36

Non-reactive diluent for epoxy resins and curing agents.

40 (20°C)
EMEAI
D.E.H.™ 4988

Fast curing agent for epoxy resins. The product contains no VOC according to the European Directive 2004/42/EC and no alkyl phenol.

500 – 700 (77°C)
EMEAI
D.E.H.™ 590

Excellent resistance to sulfuric acid (50 % to 98 %). Epoxy novolacs resins (D.E.R. 354, D.E.N. 425 or D.E.N. 431) need to be used for 98 % sulfuric acid resistance application. Good chemical resistance to concentrated hydrochloric acid

1,600 – 1,800
APAC, NAA
D.E.H.™ 591

Excellent acid resistance properties similar to D.E.H. 590 but with improved blush resistance and coating appearance.

60 – 80
NAA
D.E.H.™ 70

A liquid anhydride curing agent.

50- 70
EMEAI
D.E.H.™ 820

Polyamine Adduct based epoxy curing dissolved in water and designed to product.

17,000.0
EMEAI
FORTEGRA™ 352

A stable dispersion of preformed novel Core Shell Rubber (CSR) particles in a bisphenol A liquid epoxy resin containing 33wt% of the CSR.

248-268
17,000-23,000 *
NAA
FORTEGRA™ 100

Low-viscosity toughening agent designed for use in amine or anhydride cured epoxy systems.

N/A
3,000 – 4,000
APAC, LAA, NAA
FORTEGRA™ 102

Toughened bisphenol A liquid epoxy resin master-batch (50 wt%). Allows easy formulation into other liquid epoxy binder systems for composite as well as coating applications.

345 – 374
4,000 – 8,000
APAC
FORTEGRA™ 202

Low viscosity toughener based on innovative technology. Imparts adhesion, impact resistance and anticorrosion resistance via nanometer size phase separation in curing matrix.

N/A
4,500 – 10,000
APAC, EMEAI, NAA
FORTEGRA™ 301

Toughened liquid epoxy resin with core shell rubber particles. Offers improved toughness in coating and composite applications.

200 – 225
2700 – 3500 (1)
APAC