Curing Agents

Our line of Curing Agents—including low temperature and low emission capability offers the reliability, protection and performance you need, backed by the local customer support Only Olin can provide, virtually anywhere in the world.

Curing Agents and Hardeners

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Product Name & Description Type

AHEW Based on solids (g/eg)

OHEW (g/eq)

Viscosity @25°C (mPa.s)

Softening Point

Pot Life Min.

Ref. Resin

Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
Footnote

D.E.H.™ 125

Standard polyamide. Excellent adhesion to various substrates. Recommended for anticorrosion coatings, concrete primer and adhesives.

Modified Polyamide Curing Agent 120 8,000 – 12,000 (2) NA NA APAC (2) @ 40°C
D.E.H.™ 140

Standard polyamide. Lower viscosity, higher chemical resistance, excellent adhesion to various substrates, good balance in performances. Recommended for adhesives and anticorrosion coatings.

Modified Polyamide Curing Agent 95 10,000 – 20,000 NA NA APAC
D.E.H.™ 1450

Excellent adhesion on critical (badly prepared or wet/humid) substrates. Contains Alkyl phenol

Modified Polyamide Curing Agent 115 600 – 1,400 60 D.E.R. 331 APAC, EMEAI, LAA
D.E.H.™ 1501

Formulated Polyamide for washable tile-grouts.

Modified Polyamide Curing Agent 63 70 – 170 70 D.E.R. 331 EMEAI, LAA
D.E.H.™ 1911

Low emission curing agent particularly suited for the development of primers whenever the substrate is wet or difficult to adhere to.

Modified Polyamide Curing Agent 115 1,100 – 1,700 70 D.E.R. 3531 EMEAI, LAA
D.E.H.™ 20

Short pot-life curing agent on basis of diethylenetriamine (DETA).

(Modified-) Amine Curing Agent 21 4 – 8 25 D.E.R. 331 APAC, LAA, NAA
D.E.H.™ 2102

Recommended for mineral castings or heavy-filled mortars. Offers low exothermic reaction and give high heat resistance.

(Modified-) Amine Curing Agent 41 8 – 18 125 D.E.R. 3272 EMEAI
D.E.H.™ 2112

Recommended system, with D.E.R. 3271 epoxy resin for mineral castings or heavy-filled mortars. Offers low exotherm and give high heat resistance.

(Modified-) Amine Curing Agent 45 8 – 18 26 D.E.R. 3271 EMEAI
D.E.H.™ 2122

Recommended for mineral castings or heavy-filled mortars. Offers low exothermic reaction and give high heat resistance.

(Modified-) Amine Curing Agent 45 15 – 35 110 D.E.R. 3271 EMEAI
D.E.H.™ 2132

Very slow, low exotherm curing agent for mineral castings, composites and highly filler mortars.

(Modified-) Amine Curing Agent 45 5 – 25 >120 D.E.R. 331 EMEAI
D.E.H.™ 24

Short pot-life curing agent on basis of triethylenetetramine (TETA).

(Modified-) Amine Curing Agent 24 19.5 – 22.5 25 D.E.R. 331 APAC, LAA, NAA
D.E.H.™ 2450

Fast curing for crack-injection systems D.E.R.™ 3113 epoxy resin.

(Modified-) Amine Curing Agent 58 13 – 23 30 D.E.R. 3113 EMEAI
D.E.H.™ 2497

Low viscosity and offers long pot life. It is used as a blending curing agent.

(Modified-) Amine Curing Agent 76 30 – 100 100 D.E.R. 331 EMEAI
D.E.H.™ 26

Similar to D.E.H. 24 Epoxy Curing Agent in application, it provides lower vapor hazard to workers due to its higher boiling point.

(Modified-) Amine Curing Agent 27 50 – 60 27 D.E.R. 331 LAA, NAA
D.E.H.™ 262

Low viscosity, alkyl phenol-free curing agent for highly filled mortars, coatings and screeds.

(Modified-) Amine Curing Agent 87 30 – 70 25 D.E.R. 331 EMEAI
D.E.H.™ 2720

Fast cure down to 5 °C without presence of Benzyl alcohol or alkyl-phenols. Excellent adhesion and flexibility.

(Modified-) Amine Curing Agent 190 3,000 – 4,200 10 D.E.R. 331 EMEAI, NAA
D.E.H.™ 29

Economical mixture of linear, branched, and cyclic ethylene amines that offers higher flexibility and peel strength in applications where color is not a limitation.

(Modified-) Amine Curing Agent 29 200 – 300 24 D.E.R. 331 APAC, LAA, NAA
D.E.H.™ 2920

Low emission curing agent. Offers a long working time (long pot-life) and a quick Shore D hardness development

(Modified-) Amine Curing Agent 76 40 – 120 50 D.E.R. 3531 EMEAI
D.E.H.™ 2955

Offers very rapid curing and is highly suitable for anchoring systems or as accelerator. Suitable for primers if curing is required at temperatures down to -5°C.

(Modified-) Amine Curing Agent 82 1,400 – 1,700 6 D.E.R. 3581 EMEAI
D.E.H.™ 35

Tertiary amine accelerator based on 2,4,6-tris-(N,N-Dimethyl-aminomethyl)-Phenol. Suitable as accelerator in low temperarure curing systems or other for non-decorative epoxy applications (primers, mortars, composites,….).

NA 100 – 300 NA NA EMEAI
D.E.H.™ 36

This product is a low viscosity epoxy resin diluent that has no epoxy functionality. It can be used in the epoxy resin component as well as more frequently it is used in the curing agent component (hence the D.E.H. designation). The material is a non-VOC according to latest legislation and allows to formulate coating systems in compliance with most stringent AgBB regulations. The product is suitable as potential replacement for Benzyl alcohol knowing that the viscosity reducing power is slightly less and it offers somewhat longer pot-life

NA NA 30 – 40 NA NA EMEAI
D.E.H.™ 39

Fast curing amine hardener based on amino-ethyl piperazine. Mostly used as accelerator for other curing agent.

(Modified-) Amine Curing Agent 43 10 – 15 27 D.E.R. 331 LAA, NAA
D.E.H.™ 4042

Good color stability and high acid and solvent resistance, excellent early water spot resistance and offers very long pot life.

100 100  – 200 60 D.E.R. 331 LAA, NAA
D.E.H.™ 4043

offer good color and light stability, as well as tack-free surfaces and an excellent early water resistance. D.E.H.™ 4702 has similar performance properties but is nonyl phenol free.

115 290 – 450 40 D.E.R. 331 EMEAI
D.E.H.™ 4044

Outstanding acid- and solvent resistance and good color and UV resistance. Gives tack-free surfaces and has excellent early water resistance

115 600 – 900 25 D.E.R. 331 LAA, NAA
D.E.H.™ 4060

Offer best in class chemical resistance in combination with food contact compliance.

122 5,000 – 7,000 30 D.E.R. 331 APAC, EMEAI, LAA, NAA
D.E.H.™ 4129

For high quality coatings and flooring with good UV stability, mechanical properties and increased impact resistance.

108 700 – 1,000 20 D.E.R. 331 APAC, LAA, NAA
D.E.H.™ 4147

Offer very good UV-stability with only a low tendency to yellowing. Especially suitable for color quartz and paints

75 150 – 300 30 D.E.R. 331 EMEAI
D.E.H.™ 4353

Universal curing agent offering a long pot life and is suitable for adhesives, highly filled coating systems, mortars and screeds. D.E.H.™ 487 is a nonyl-phenol-free version.

93 80 – 180 50 D.E.R. 331 EMEAI
D.E.H.™ 4354

Universal curing agent offering a faster reactivity. D.E.H.™ 488 and D.E.H. 489 are equivalent nonyl-phenol-free versions.

95 150 – 350 25 D.E.R. 331 EMEAI
D.E.H.™ 444

Longer pot-life curing agent with good UV stability.

93 160 – 220 105 D.E.R. 331 EMEAI, LAA, NAA
D.E.H.™ 445

Low viscosity curing agent with good UV stability and overall mechanical & chemical resistance properties

105 370  – 570 45 D.E.R. 331 EMEAI, LAA, NAA
D.E.H.™ 4702

Excellent early water-spot resistance combined with high acid and solvent resistance.

115 370 – 470 40 D.E.R. 331 APAC, EMEAI, LAA, NAA
D.E.H.™ 4712

Offers systems with good UV-stability and is therefore suitable for paints and coatings as well as floorings

87 1,600 – 2,400 20 D.E.R. 3581 APAC, EMEAI, LAA, NAA
D.E.H.™ 4723

Recommended for elastic intermediate layers, especially when used in combination with D.E.R.™ 3911. It provides very high flexibility with elongation at break around 200%.

120 750 – 1,150 55 D.E.R. 3911 EMEAI
D.E.H.™ 487

Longer pot-life version of D.E.H. 488 curing agent

93 170  – 270 41 D.E.R. 331 EMEAI, LAA, NAA
D.E.H.™ 488

Low viscosity, curing agent for liquid epoxy resins. Good blush resistance and general chemical resistance.

93 280 – 380 25 D.E.R. 331 EMEAI, LAA, NAA
D.E.H.™ 489

Accelerated version of D.E.H. 488 curing agent

93 210 – 290 20 D.E.R. 331 EMEAI, LAA, NAA
D.E.H.™ 4909

Free of benzyl alcohol, nonyl phenol, Bisphenol A and any inert volatile compounds for low-emission flooring systems. Excellent wetting, long pot-life and quick tack-free time.

83 180 – 280 60 D.E.R. 3531 NAA
D.E.H.™ 4912

Fully reactive curing agent containing no VOC and no alkyl phenol. Shows low exothermic reaction.

84 280 – 480 40 D.E.R. 3531 EMEAI, NAA
D.E.H.™ 4913

D.E.H. 4913 offers rapid shore D hardness and is therefore suitable to accelerate low-emission flooring systems

93 320 – 520 30 D.E.R. 3531 EMEAI
D.E.H.™ 4914

Excellent corrosions resistance and impact resistance for wet-paints on metallic substrates.

108 8,000 – 10,000 45 D.E.R. 331 EMEAI
D.E.H.™ 4988

Fast curing agent for epoxy resins. The product contains no VOC according to the European Directive 2004/42/EC and no alkyl phenol.

53 500 – 700 12 D.E.R. 3274 EMEAI
D.E.H.™ 502

Viscous, low temperature curing agent with good solvent and chemical resistance.

(Modified-) Amine Curing Agent 44 2,500 – 4,000 14 D.E.R. 331 LAA, NAA
D.E.H.™ 505

Very fast curing agent that provides rapid development of properties. Accelerator for other amine curing agents.

(Modified-) Amine Curing Agent 95 3,000 – 4,000 6 D.E.R. 331 LAA
D.E.H.™ 508

Reactive low viscous curing gent with good chemical resistance and high strength.

(Modified-) Amine Curing Agent 34 100 – 300 12 D.E.R. 331 LAA
D.E.H.™ 5103

Light color amine adduct with good chemical and alcohol resistance.

(Modified-) Amine Curing Agent 45 2,200 – 5,500 (2) 15 D.E.R. 331 NAA (2) @ 40°C
D.E.H.™ 512

Fast low viscosity curing agent with good flexibility and blush resistance.

(Modified-) Amine Curing Agent 86 150 – 350 9 D.E.R. 331 LAA
D.E.H.™ 517

Low viscosity aliphatic amine adduct with high strength and modulus and provides good heat and chemical resistance. It has wide variety of applications in adhesives, trowelable flooring, mortars, grouts and patching compounds.

(Modified-) Amine Curing Agent 31 50 – 150 35 D.E.R. 331 NAA
D.E.H.™ 52

Viscous, room temperature curing agent that has a short pot life and convenient handling and mixing rates with liquid epoxy resins.

42 – 47 5,000 – 7,500 18 D.E.R. 331 LAA, NAA
D.E.H.™ 530

Rapid set, low temperature curing agent for high gloss, blush-free products with good mechanical, chemical and water spot resistance.

112 300  – 400 43 D.E.R. 331 LAA, NAA
D.E.H.™ 530 E32

Rapid set, low temperature curing agent for applications requiring good color stability and resistance to blushing and water spotting.

112 400 – 600 46 D.E.R. 331 LAA, NAA
D.E.H.™ 534

Rapid set, low temperature curing agent offering good corrosion protection and water spot resistance.

120 500 – 1,000 18 D.E.R. 331 LAA, NAA
D.E.H.™ 536

Low viscosity, low temperature curing agent for applications requiring high gloss and good color stability.

116 750 – 1,250 14 D.E.R. 331 LAA, NAA
D.E.H.™ 538

Low viscosity curing agent with good color stability.

108 250 – 500 33 D.E.R. 331 LAA, NAA
D.E.H.™ 545

Polyamide curing agent offering excellent adhesion onto highly humid or wet substrates. Good corrosion protection and low viscosity

Modified Polyamide Curing Agent 115 400 – 650 39 D.E.R. 331 LAA, NAA
D.E.H.™ 546

Very low viscosity curing agent for applications requiring low color, excellent color stability, and rapid-set at low temperatures.

95 200 – 400 25 D.E.R. 331 LAA, NAA
D.E.H.™ 55

Medium viscosity, room-temperature, accelerated curing agent that is good for systems requiring low color.

(Modified-) Amine Curing Agent 40 – 42 1,000 – 1,700 11 D.E.R. 331 LAA, NAA
D.E.H.™ 554

Low viscosity curing agent for applications requiring self-leveling with chemical, blushing and water spot resistance.

86 60 – 80 38 D.E.R. 331 LAA, NAA
D.E.H.™ 561

Low viscosity, low temperature curing agent for blush-free products with good water spot resistance and excellent chemical resistance to acids and solvents.

(Modified-) Amine Curing Agent 85 40  – 100 17 D.E.R. 331 LAA, NAA
D.E.H.™ 570

Low viscosity curing agent with good chemical and water resistance.

72 70 – 160 25 D.E.R. 331 LAA, NAA
D.E.H.™ 58

Room-temperature, low viscosity curing agent that is extremely reactive with liquid epoxy resins.

(Modified-) Amine Curing Agent 28 – 32 85 – 130 15 D.E.R. 331 LAA, NAA
D.E.H.™ 580

Low viscosity curing agent for applications requiring self-leveling with chemical, blushing and water spot resistance.

112 300 -400 42 D.E.R. 331 LAA, NAA
D.E.H.™ 581

Low viscosity, low temperature curing agent for products with good color and light stability.

95 250 – 600 9 D.E.R. 331 LAA, NAA
D.E.H.™ 582

Low viscosity curing agent for non-blushing products with good impact resistance and high gloss.

102 250 – 600 22 D.E.R. 331 LAA, NAA
D.E.H.™ 583

Low viscosity, low temperature curing agent for blush-free products with good water spot resistance and excellent chemical resistance.

95 250 – 600 37 D.E.R. 331 LAA, NAA
D.E.H.™ 584

Light color, moisture-insensitive curing agent with good color stability and long pot life for high gloss, blush-free, impact-resistant coatings.

(Modified-) Amine Curing Agent 86 30  – 60 150 D.E.R. 331 LAA, NAA
D.E.H.™ 585

Light color, moisture-insensitive curing agent with good color stability and long pot life for high gloss, blush-free, impact-resistant coatings.

(Modified-) Amine Curing Agent 91 150 – 250 77 D.E.R. 331 LAA, NAA
D.E.H.™ 586

Very fast ambient and low temperature curing agent for non-blushing products with good water spot resistance, excellent chemical resistance, high gloss and high strength.

86 30 – 60 45 D.E.R. 331 LAA, NAA
D.E.H.™ 589

Low viscosity, low temperature curing agent for products with good color and light stability.

83 50  – 100 22 D.E.R. 331 LAA, NAA
D.E.H.™ 590

Excellent resistance to sulfuric acid (50 % to 98 %). Epoxy novolacs resins (D.E.R. 354, D.E.N. 425 or D.E.N. 431) need to be used for 98 % sulfuric acid resistance application. Good chemical resistance to concentrated hydrochloric acid. Contains NAA exempt solvents.

83 1,600 – 1,800 38 D.E.R. 354 APAC, NAA
D.E.H.™ 591

Excellent acid resistance properties similar to D.E.H. 590 but with improved blush resistance and coating appearance. Contains NAA exempt solvents.

65 60 – 80 33 D.E.R. 354 NAA
D.E.H.™ 595

Very fast ambient and low temperature curing agent for non-blushing products with good water spot resistance, excellent chemical resistance, high gloss and high strength.

75 1,000 – 1,500 16 D.E.R. 331 LAA, NAA
D.E.H.™ 598B

Rapid-set, low temperature curing agent with good water spot and chemical resistance for high gloss, blush-free, high strength coatings.

(Modified-) Amine Curing Agent 75 50 – 200 16 D.E.R. 331 LAA, NAA
D.E.H.™ 599

Used for low modulus, highly flexible epoxy membranes and underlayments.

(Modified-) Amine Curing Agent 224 3,500 – 4,500 19 D.E.R. 331 NAA
D.E.H.™ 611

Medium viscosity modified aliphatic amine curing agent with very fast set time and good low temperature cure. May be used as accelerator for other amine based curing agents.

Low Temperature Curing Agent 91 1500 – 4,000 6 D.E.R. 331 NAA
D.E.H.™ 613

Shorter pot-life version of D.E.H. 614 curing agent

Low Temperature Curing Agent 90 900 – 1,300 10 D.E.R. 331 APAC, NAA
D.E.H.™ 614

Solvent-free, Mannich base curing agent curing down to about 0 °C. High water and chemical resistance.

Low Temperature Curing Agent 85 450 – 750 15 D.E.R. 331 EMEAI, NAA
D.E.H.™ 615

Low viscosity version of D.E.H. 614 curing agent. Over-coatable after 4 hours (industrial coatings).

Low Temperature Curing Agent 75 400 – 500 15 D.E.R. 331 APAC, EMEAI, NAA
D.E.H.™ 616

Good cure rate above 0 °C and high water resistance.

Low Temperature Curing Agent 75 400 – 600 15 D.E.R. 331 NAA
D.E.H.™ 622

Modified amine curing agent with extreme high reactivity. Cures down to -5 °C

Low Temperature Curing Agent 60 490 – 690 6 D.E.R. 331 APAC, EMEAI, LAA, NAA
D.E.H.™ 630

Highly reactive (non-Mannich base) curing agent with an improved EH&S profile, better chemical resistance and UV-stability over traditional Mannich base curing agents.

Low Temperature Curing Agent 73 700 – 900 14 D.E.R. 3531 EMEAI
D.E.H.™ 650

Aromatic amine suitable for curing liquid epoxy resins at elevated temperatures. Able to achieve glass transition temperature of 190 °C with regular liquid epoxy resin.

Heat cure amine 46 300 – 400 51 (3) D.E.R. 383 EMEAI, NAA (3) at 80 degrees centigrade
D.E.H.™ 70

A liquid anhydride curing agent

Anhydride Curing Agent 160 50 – 70 NA NA EMEAI
D.E.H.™ 71

A liquid anhydride curing agent

Anhydride Curing Agent 160 50 – 70 NA NA EMEAI
D.E.H.™ 80

Phenolic hardener containing 0.7 wt% curing catalyst and about 2.5 wt% polyacrylate flow modifier of moderate reactivity. Phenolic curing agents offer excellent chemical and moisture/water resistance and improved flexibility compared to i.e. Dicyandiamide curing agents.

Phenolic Curing Agent 245 – 275 290 – 470 (1) 83 – 90 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC
D.E.H.™ 81

Phenolic curing agent of intermediate reactivity containing 2 wt% curing catalyst as well as about 2.5 wt% polyacrylate flow modifier. The intermediate reactivity makes D.E.H. 81 particularly suitable as starting base for product development.

Phenolic Curing Agent 240 – 270 290 – 470 (1) 83 – 90 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC
D.E.H.™ 82

High reactivity phenolic curing agent containing 3.5 wt% curing catalyst as well as about 2.5 wt% polyacrylate flow modifier. Can be formulated in low application temperature applications in combination with D.E.R. 6615 solid epoxy resin.

Phenolic Curing Agent 235 – 265 290 – 470 (1) 83 – 90 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC
D.E.H.™ 84

Phenolic curing agent of intermediate reactivity containing only about 1.9 wt% curing catalyst. The lack of flow modifier allows formulation with alternative additives that could potentially cause compatibility problems.

Phenolic Curing Agent 240 – 270 290 – 470 (1) 83 – 90 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC
D.E.H.™ 85

Unmodified phenolic curing agent particularly suitable for optimizing the reactivity of hardeners such as D.E.H. 81, D.E.H. 82 or D.E.H. 84 phenolic curing agent.

Phenolic Curing Agent 250 – 280 290 – 470 (1) 83 – 90 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC
D.E.H.™ 87

Unmodified higher molecular weight phenolic curing agent providing improved flexibility and good storage stability.

Phenolic Curing Agent 370 – 400 1,200 – 1,600 (1) 96 – 102 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC
D.E.H.™ 90

Phenolic curing agent for fast cure combined with superior adhesion under humid conditions.

High Performance Powder Coating Hardener 240 – 270 100 – 300 (1) 76 – 84 NA NA APAC, EMEAI, LAA, NAA (1) Melt-viscosity at 150 ᵒC