Electronics – Coatings (Resins & Systems)

Approximately 2.4 functional low viscosity liquid epoxy novolac resin. D.E.N. 424 fills the gap between the standard Bisphenol F based liquid epoxy resin and multifunctional, low viscosity epoxy novolac resin D.E.N 425. Compared to standard Bisphenol A and Bisphenol F based liquid epoxy resins, D.E.N. 424 produces an improved crosslinked system, which enables better thermal and chemical resistance with a low viscosity that is necessary for easy processing and application.

Approximately 2.6 functional medium viscosity liquid epoxy novolac resin.  D.E.N. 426 fills the gap between lower viscosity epoxy novolac resins such as D.E.N. 424 and higher viscosity epoxy novolac resins such as D.E.N. 431 and D.E.N. 438. When using D.E.N. 426 with carefully selected curing agents, the system provides faster thin film drying time at ambient temperature and has better resistance to chemicals such as acetic acid, toluene, and methanol.

Multi-functional (±2.8) epoxy novolac resin of lower molecular weight for application where solvents cannot be tolerated and application viscosity (temperature) needs to remain relatively low. Used in adhesives, electrical and structural laminates and castings for elevated temperature service and excellent chemical resistance.

Highly functional (±3.6) epoxy novolac resin offering best mechanical, temperature and chemical resistance performance with acceptable viscosity. Recognized as a standard for high-temperature applications.

Solution of D.E.N. 438 in methyl-ethyl ketone mainly for laminating or Prepreg applications.

Solution of D.E.N. 438 in methyl iso-butyl ketone mainly for laminating or Prepreg applications.

Solution of D.E.N. 438 in Xylene. Main use in wet-paint systems with high temperature or chemical resistance requirements.

Highly functional (±3.8) epoxy novolac resin with improved reactivity. The higher viscosity offers a means of obtaining good drape and limited tack in Prepreg formulations.

Highly functional epoxy novolac resin with lower processing variability.

Modified liquid epoxy resin; compared with standard bisphenol A based liquid epoxy resin, similar viscosity, improved flexibility, longer pot life and anticorrosion performance; suitable for high solids (80% volume solid above) formulation.

Lower viscosity bisphenol-A epoxy resin with very low hydrolysable chloride content (<100 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

Intermediate viscosity epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications.

Solution of D.E.R. 337 in xylene. The excellent resistance and physical properties for epoxy coal tar combinations and higher solids content marine coatings.

D.E.R. 354LV Liquid Epoxy Resin is an unmodified bisphenol F based liquid, low viscosity epoxy resin. It is compatible with common epoxy resins and can be blended with them in any ratio. It achieves a high degree of cure at ambient temperatures, providing improved resistance performance against solvents compared to standard bisphenol A liquid epoxy resins.

Ultra Low viscosity liquid epoxy resin modified with a Cycloaliphatic polyglycidyl ether for high solids coating formulations with ultra low volatile organic compound (VOC) emissions and ease of application. Excellent corrosion protection and chemical resistance. Can be cured with multiple types of curing agents (hardeners)

Multi-functional (+/- 2.6) Ultra Low Viscosity Novolac resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) for high solids coating formulations with low volatile organic compound (VOC) emissions. Balance of properties similar to solvent borne Novolac.

Low molecular weight high Tg epoxy resin modified with oxazolidone to improve tougness. To be used as an adhesion promoter as well.