Products for Laminates used in Electronics (Resins & Systems)
| Product Name & Description | Category | Type | EEW Based on solids (g/eq) | Viscosity @25°C (mPa.s) | Softening Point | Solids Content (wt%) | Regional Availability
APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India LAA - Latin America Area NAA - North America Area |
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D.E.N.® 424
Approximately 2.4 functional low viscosity liquid epoxy novolac resin. D.E.N. 424 fills the gap between the standard Bisphenol F based liquid epoxy resin and multifunctional, low viscosity epoxy novolac resin D.E.N 425. Compared to standard Bisphenol A and Bisphenol F based liquid epoxy resins, D.E.N. 424 produces an improved crosslinked system, which enables better thermal and chemical resistance with a low viscosity that is necessary for easy processing and application. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 165 – 175 | 5,700 – 6,800 | – | – | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 425
Approximately 2.5 functional liquid epoxy novolac resin bridging between standard liquid epoxy resin and semi-solid epoxy novolac resins. When used in combination with a fast curing agent no post-cure is required and binder systems are obtained with excellent mechanical and especially solvent resistance properties. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 169 – 175 | 9,500 – 12,500 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 426
Approximately 2.6 functional medium viscosity liquid epoxy novolac resin. D.E.N. 426 fills the gap between lower viscosity epoxy novolac resins such as D.E.N. 424 and higher viscosity epoxy novolac resins such as D.E.N. 431 and D.E.N. 438. When using D.E.N. 426 with carefully selected curing agents, the system provides faster thin film drying time at ambient temperature and has better resistance to chemicals such as acetic acid, toluene, and methanol. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 167 – 177 | 18,000 – 23,000 | – | – | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 428
Multi-functional (±2.8) epoxy novolac resin of lower viscosity compared to the higher viscosity epoxy novolac epoxy resin D.E.N. 431. In addition to improved processing of this medium viscosity novolac resin, D.E.N. 428 is distinguished by particularly good thermal resistance, chemical resistance, and mechanical properties. With these characteristic properties, D.E.N. 428 is suitable for applications such as protective coatings or linings for storage tanks, pipes, and pumps. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 168 – 178 | 35,000 – 45,000 | – | – | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 431
Multi-functional (±2.8) epoxy novolac resin of lower molecular weight for application where solvents cannot be tolerated and application viscosity (temperature) needs to remain relatively low. Used in adhesives, electrical and structural laminates and castings for elevated temperature service and excellent chemical resistance. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 172 – 179 | 1,100 – 1,700 (1) | – | 100 | APAC, EMEAI, LAA, NAA | 1 at 51.7°C |
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D.E.N.® 431 EK98
Solution of D.E.N. 431 in methyl-ethyl ketone® |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 172 – 179 | 5,000 – 25,000 | – | 98 | NAA | – |
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D.E.N.® 438®
Highly functional (±3.6) epoxy novolac resin offering best mechanical, temperature and chemical resistance performance with acceptable viscosity. Recognized as a standard for high-temperature applications. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 176 – 181 | 31,000 – 40,000 (1) | – | 100 | APAC, EMEAI, LAA, NAA | 1 at 51.7°C |
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D.E.N.® 438-A85
Solution of D.E.N. 438 in acetone mainly for laminating or Prepreg applications. |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 176 – 181 | 500 – 1,200 | – | 84 – 86 | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 438-EK85
Solution of D.E.N. 438 in methyl-ethyl ketone mainly for laminating or Prepreg applications. |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 176 – 181 | 600 – 1,600 | – | 84 – 86 | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 438-MAK80
Solution of D.E.N. 438 in methyl n-amyl ketone mainly for laminating or Prepreg applications. |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 176 – 181 | 600 – 1,200 | – | 79 – 81 | NAA | – |
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D.E.N.® 438-MK75
Solution of D.E.N. 438 in methyl iso-butyl ketone mainly for laminating or Prepreg applications. |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 176 – 181 | 200 – 600 | – | 74 – 76 | NAA | – |
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D.E.N.® 438-MK80
Solution of D.E.N. 438 in methyl iso-butyl ketone mainly for laminating or Prepreg applications. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 176 – 181 | 800 – 1200 | – | 80 | LAA, NAA | – |
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D.E.N.® 438-X80
Solution of D.E.N. 438 in Xylene. Main use in wet-paint systems with high temperature or chemical resistance requirements. |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 176 – 181 | 1,200 – 2,000 | – | 79 – 81 | APAC, EMEAI, LAA, NAA | – |
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D.E.N.® 438L
Low(er) viscosity version of D.E.N. 438 epoxy novolac resin to allow higher solids and/or lower viscosity formulations. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 176 – 181 | 27,500 – 32,500 (1) | – | 100 | APAC, EMEAI, LAA, NAA | 1 at 51.7°C |
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D.E.N.® 439
Highly functional (±3.8) epoxy novolac resin with improved reactivity. The higher viscosity offers a means of obtaining good drape and limited tack in Prepreg formulations. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 191 – 210 | 15,000 – 35,000 (2) | – | 100 | APAC, EMEAI, LAA, NAA | 2 at 71°C |
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D.E.N.® 439-EK85
Solution of D.E.N. 439 in methyl-ethyl ketone mainly for laminating or Prepreg applications. |
Epoxy Novolac Resins | Epoxy Novolac Solutions | 191 – 210 | 4,000 – 10,000 | – | 84 – 86 | NAA | – |
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D.E.N.® 439-H
Highly functional epoxy novolac resin with lower processing variability. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 191 – 210 | 23,000 – 29,000 (2) | – | 100 | NAA | 2 at 71°C |
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D.E.N.® 440
Extremely high functional (± 4.4) epoxy novolac resin. Offers highest performance in this product group with regards to mechanical, temperature and chemical resistance properties. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 186 – 192 | 20,000 – 45,000 (2) | – | 100 | APAC, EMEAI, LAA, NAA | 2 at 71°C |
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D.E.R.® 301
Modified liquid epoxy resin; compared with standard bisphenol A based liquid epoxy resin, similar viscosity, improved flexibility, longer pot life and anticorrosion performance; suitable for high solids (80% volume solid above) formulation. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 245 – 265 | 10,000 – 14,000 | – | 100 | APAC | – |
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D.E.R.® 317
High viscosity, fast reacting (20% faster than D.E.R. 331) liquid epoxy resin designed for adhesive applications requiring quick gelling with amine curing agents. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 192 – 203 | 16,000 – 25,000 | – | 100 | NAA | – |
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D.E.R.® 321
Very low viscosity resin allowing large amounts of fillers. Cure rate similar to undiluted resins. Improved acid resistance can be observed. For floorings, grouting, concrete reinforcement, structural adhesives, crack injection and castings. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 180 – 188 | 500 – 700 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 3212
Similar to D.E.R. 321 epoxy resin but of higher viscosity maintaining more mechanical strength. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 179 – 193 | 750 – 1,400 | – | 100 | LAA, NAA | – |
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D.E.R.® 322
Low diluent content resin combining significant viscosity reduction whilst maintaining mechanical strength properties. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 183 – 193 | 5,500 – 8,500 | – | 100 | NAA | – |
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D.E.R.® 3221
Liquid epoxy resin especially suitable for use in water borne epoxy binder systems. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 187 – 208 | 700 – 1,000 | – | 100 | EMEAI | – |
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D.E.R.® 324
Offers low viscosity and low surface tension to wet the surface better, giving better adhesion and slightly lower viscosity at any given filler loading. The diluent increases pot life, flexibility (impact resistance) and acid resistance. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 195 – 204 | 600 – 800 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 325
Low viscosity liquid epoxy resin with reduced surface tension. Offers excellent wetting and flow. The low diluent content is the cause of the improved mechanical properties over D.E.R. 323 and D.E.R. 324 epoxy resin. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 185 – 206 | 850 – 2,800 | – | 100 | NAA | – |
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D.E.R.® 326
Low viscosity liquid epoxy resin with minimal crystallization tendency. Offers low surface tension, excellent wetting and flow. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 204 – 210 | 600 – 900 | – | 100 | NAA | – |
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D.E.R.® 327
Lower viscosity and easier to handle than D.E.R. 326 with minimal crystallization tendency. Offers low surface tension, excellent wetting and flow. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 196 – 212 | 500 – 700 | – | 100 | LAA, NAA | – |
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D.E.R.® 3271
Very low viscosity epoxy resin designed for mineral castings in combination with e.g. D.E.H. 2112 epoxy curing agent. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 156 – 170 | 250 – 450 | – | 100 | EMEAI | – |
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D.E.R.® 3274
Bi-functional reactive diluent containing resin offering reduced viscosity whilst only affecting the mechanical and thermal properties moderately. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 160 – 180 | 1,300 – 1,500 | – | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 3282
Reactive diluent containing epoxy resin offering low viscosity, good mechanical properties as well as solvent resistance. |
Liquid Epoxy Resins | Modified Bisphenol A Liquid Epoxy Resins | 173 – 183 | 900 – 1,100 | – | 100 | APAC, EMEAI | – |
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D.E.R.® 330
D.E.R. 330 epoxy resin is a low viscosity bisphenol A epoxy resin commonly used in composite and casting applications. D.E.R. 330 epoxy resin frequently crystallizes at room temperature; heating to 50-55°C restores the resin to liquid state. Long-term warm storage may result in slight discoloration but does not affect the resin performance. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 176 – 185 | 7,000 – 10,000 | – | 100 | APAC, EMEAI, NAA | – |
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D.E.R.® 330-EL
Lower viscosity bisphenol-A epoxy resin with very low hydrolysable chloride content (<100 ppm). Specifically suitable for electrical, electronic and encapsulation applications. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 176 – 185 | 7,000 – 10,000 | – | 100 | EMEAI | – |
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D.E.R.® 331®
Industry standard bisphenol-A based liquid epoxy resin. Offers excellent mechanical, thermal and chemical resistance properties in multiple applications. Shows improved reactivity and wetting properties versus competitive alternatives. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 182 – 192 | 11,000 – 14,000 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 331-EL
Standard bisphenol-A epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 182 – 192 | 11,000 – 14,000 | – | 100 | EMEAI | – |
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D.E.R.® 332
High purity diglycidylether ether of bisphenol A. Its high purity and low oligomer content assures uniform performance, exceptionally low viscosity and improved elevated temperature properties over standard epoxy resins. This resin grade is mainly used in electrical encapsulation applications. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 171 – 175 | 4,000 – 6,000 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 336
Standard liquid bisphenol-A epoxy resin of intermediate viscosity and equivalent weight with narrow specification limits. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 181 – 185 | 9,400 – 11,000 | – | 100 | EMEAI | – |
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D.E.R.® 336-EL
Intermediate viscosity epoxy resin with very low hydrolysable chloride content (<150 ppm). Specifically suitable for electrical, electronic and encapsulation applications. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 181 – 185 | 9,400 – 11,000 | – | 100 | EMEAI | – |
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D.E.R.® 337
Intermediate epoxy equivalent weight semi-solid epoxy resin, mainly used in adhesives and protective coatings, or as a modifier for other epoxy resins to improve impact strength, extensibility and adhesion. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 230 – 250 | 400 – 800 (1) | – | 100 | APAC, EMEAI, NAA | (1) 70 wt% in diethylene glycol monobutyl ether |
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D.E.R.® 3401
Low viscosity rapidly reacting Bisphenol A/F epoxy resin designed for fast-curing coatings, adhesives, and mortars. It can be used as the sole epoxy or in combination with other epoxy resins. Rapid cure, return to service, Low emissions or substance of concern content, Low viscosity, Good chemical resistance |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 175 – 215 | 1,500 – 3,500 | – | 100 | NAA | – |
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D.E.R.® 3411
Accelerated, crystallization stable liquid epoxy resin. |
Liquid Epoxy Resins | Accelerated Epoxy Resins | 185 – 205 | 4,500 – 5,500 | – | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 350
D.E.R. 350 is a bisphenol F epoxy resin that has a low tendency to crystallize. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 165 – 174 | 2500 – 4500 | – | 100 | APAC, LAA, NAA | – |
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D.E.R.® 351
D.E.R. 351 liquid epoxy resin is a low viscosity epoxy resin combining the performance properties of standard bisphenol A epoxy resin with the low viscosity of bisphenol F epoxy resin. The resin blend shows a low tendency to crystallization. Applications include solvent-free coatings, tank- and pipe-linings, concrete reinforcements and also floorings, adhesives, electrical insulation and filament winding. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 169 – 181 | 1500 – 6500 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 352
Higher viscosity and more economic bisphenol-A/F liquid epoxy resin. Recommended base for many modified bisphenol-A/F liquid epoxy resins. |
Liquid Epoxy Resins | Bisphenol A/F Liquid Epoxy Resins | 172 – 181 | 5,700 – 7,700 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 353
Low viscosity epoxy resin with very low crystallization tendency. Offers low surface tension to wet the surface better, giving better adhesion. The diluent increases pot life, flexibility (impact resistance) and acid resistance. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 190 – 200 | 800 – 1,000 | – | 100 | APAC, LAA, NAA | – |
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D.E.R.® 3531
Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers low viscosity and good wetting properties it is suitable for casting resin coatings and adhesives |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 183 – 199 | 750 – 1,150 | – | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 3532
Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers very low viscosity and good wetting properties. Similar to D.E.R. 3531 in nature. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 181 – 200 | 500 – 900 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 3533
Low crystallization resin with low vapor pressure and hydrophobic in nature. Offers extremely low viscosity and good wetting properties. Similar to D.E.R. 3531/3532 in nature. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 187 – 200 | 450 – 550 | – | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 354
Unmodified bisphenol F-based epoxy resin of low viscosity. Improves crystallization resistance of other epoxy resins and gives improvement in solvent resistance. Frequently used in solvent-free coatings, floor coverings, adhesives or composite applications. |
Liquid Epoxy Resins | Bisphenol F Epoxy Resins | 167 – 174 | 3,400 – 4,200 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 354LV
D.E.R. 354LV Liquid Epoxy Resin is an unmodified bisphenol F based liquid, low viscosity epoxy resin. It is compatible with common epoxy resins and can be blended with them in any ratio. It achieves a high degree of cure at ambient temperatures, providing improved resistance performance against solvents compared to standard bisphenol A liquid epoxy resins. |
Liquid Epoxy Resins | Bisphenol F Epoxy Resins | 158 – 170 | 1300 – 3000 | – | 100 | LAA, NAA | – |
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D.E.R.® 356
The product performance is very similar to that obtained with D.E.R. 352 Resin except that this resin will provide a more rapid cure (higher reactivity). |
Liquid Epoxy Resins | Bisphenol A/F Liquid Epoxy Resins | 176 – 183 | 6,500 – 8,000 | – | 100 | APAC, EMEAI, LAA | – |
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D.E.R.® 3572
Liquid epoxy resin, modified with a di-funtional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 164 – 176 | 600 – 900 | – | 100 | APAC, EMEAI | – |
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D.E.R.® 3581
Liquid epoxy resin, modified with a lower vapor pressure di-functional reactive diluent. Offers improved reactivity, better mechanical properties as well as solvent resistance versus mono functional aliphatic diluents. |
Liquid Epoxy Resins | Modified Bisphenol A/F Liquid Epoxy Resins | 169 – 180 | 900 – 1,400 | – | 100 | APAC, EMEAI | – |
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D.E.R.® 383
Lower viscosity bisphenol-A epoxy resin allowing the use of less diluents or more fillers in the formulation. Offers longer pot-life versus the standard resin and slightly improved resistance properties when used in heat curing (composite) applications. |
Liquid Epoxy Resins | Bisphenol A Liquid Epoxy Resins | 176 – 183 | 9,000 – 10,500 | – | 100 | APAC, LAA, NAA | – |
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D.E.R.® 530-A80
Standard brominated epoxy resin in acetone with about 20.5 % bromine on solids. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 425 – 440 | 1,500 – 2,500 | – | 79 – 81 | APAC, EMEAI, NAA | – |
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D.E.R.® 537 PMK 70
Standard brominated epoxy resin in Dowanol PM and MEK with about 20 % bromine on solids. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 440 – 500 | 100 – 1,000 | – | 69 – 71 | EMEAI | – |
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D.E.R.® 538-A80
Brominated epoxy resin in acetone with about 20% bromine on solids. Offers less flow during lamination versus D.E.R. 530-A80 epoxy resin. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 465 – 495 | 800 – 1,800 | – | 79 – 81 | APAC, NAA | – |
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D.E.R.® 539-A80
Standard brominated epoxy resin in acetone having UV blocking properties. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 430 – 470 | 1,000 – 1600 | – | 79 – 81 | APAC | – |
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D.E.R.® 539-EK80
Brominated epoxy resin in methyl ethyl ketone with about 20% bromine on solids. Offers enhanced UV-blocking and fluorescence. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 430 – 470 | 1,500 – 2,000 | – | 79 – 81 | APAC, EMEAI | – |
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D.E.R.® 542
Solid epoxy resin with approximately 48% bromine for flame retardancy |
Flame Retardant Systems | Brominated Epoxy Resins | 305 – 355 | NA | 52 – 62 | 100 | APAC, EMEAI, LAA, NAA | – |
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D.E.R.® 560
Higher molecular weight solid epoxy resin with approximately 48% bromine for flame retardancy. Gives improved flexibility |
Flame Retardant Systems | Brominated Epoxy Resins | 440 – 470 | 140 – 215 (1) | 78 – 85 | 100 | APAC, EMEAI, NAA | (1) @ 150 ᵒC |
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D.E.R.® 592-A80
Brominated epoxy resin in acetone with about 17% bromine on solids. Offers best dimensional stability and better chemical resistance that standard resins. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 350 – 370 | 1,000 – 2,400 | – | 79 – 81 | APAC, EMEAI, NAA | – |
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D.E.R.® 593
Brominated epoxy resin in DOWANOL™ PM glycol ether with about 17 wt% bromine on solids. Allows quicker cure and higher Tg due to the large amount of catalyst that can be added. |
Flame Retardant Systems | Brominated Epoxy Resin Solution | 350 – 370 | 400 – 1,100 | – | 74 – 76 | APAC, EMEAI, NAA | – |
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DLVNE® 61
Multi-functional (+/- 3.1) Ultra Low Viscosity Novolac resin modified with a Cycloaliphatic polyglycidyl ether (free of any organic solvent) that facilitate high solids coating formulations with low volatile organic compound (VOC) emissions, improved application, strong chemical and thermal resistance. |
DLVE® & DLVNE®, Epoxy Novolac Resins | Ultra Low Viscosity Epoxy Novolac Resins | 155 – 170 | 4,500 – 6,500 | – | 100 | APAC, EMEAI, LAA, NAA | – |
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FORTEGRA® 202
Low viscosity toughener based on innovative technology. Imparts adhesion, impact resistance and anticorrosion resistance via nanometer size phase separation in curing matrix. |
Epoxy Toughening / Flexibilizing Solutions | Toughened Epoxy Resins | N/A | 4,500 – 8,000 | – | – | APAC, EMEAI, NAA | – |
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FORTEGRA® 352
A stable dispersion of preformed novel Core Shell Rubber (CSR) particles in a bisphenol A liquid epoxy resin containing 33wt% of the CSR. |
Epoxy Toughening / Flexibilizing Solutions | Toughened Epoxy Resins | 248 – 268 | 17,000 – 23,000 (2) | – | – | APAC, EMEAI, LAA, NAA | (2) @ 50 °C |
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Prologic BF 150R (XZ 92748.00)
Epoxy novolac resin solution, suitable for mid – high Tg halogen free electrical laminates. |
Flame Retardant Systems | Halogen-free Epoxy Resin Solution | 176 – 181 | NA | – | 84-86 | APAC | – |
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XU 19651
Blend of D.E.N. 438 and difunctional reactive diluent for easier handling for flooring and grouts. |
Epoxy Novolac Resins | Epoxy Novolac Resins | 145 – 158 | 300 – 500 | – | 100 | LAA, NAA | – |
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XZ 92757.00
High functional bisphenol A epoxy novolac solution in MEK at 75% solid useful for high Tg composites and electrical laminate applications |
Flame Retardant Systems | Halogen-free Epoxy Resin Solution | 195 – 210 | 500 – 4,000 | – | 74 – 76 | APAC | – |
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XZ 97103.00
Low molecular weight high Tg epoxy resin modified with oxazolidone to improve tougness. To be used as an adhesion promoter as well. |
Epoxy Toughening / Flexibilizing Solutions | Toughened Epoxy Resins | 280 – 305 | 500 – 2,500 | – | 74 – 76 | APAC | – |