Electronics – Adhesives (Curing Agents & Hardeners)

Products for Adhesives used in Electronics (Curing Agents & Hardeners)

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Product Name & Description Category

 Type

 AHEW Based on solids (g/eg)

 Viscosity @25°C (mPa.s)

 Pot Life Min.

 Ref. Resin

 Regional Availability

APAC - Asia, Pacific
EMEAI - Europe, Middle East, Africa, India
LAA - Latin America Area
NAA - North America Area
Footnote
D.E.H.® 20

Short pot-life curing agent on basis of diethylenetriamine (DETA).

 Curing Agents and Hardeners (Modified-) Amine Curing Agent 21 4 – 8 25 D.E.R. 331 LAA, NAA –
D.E.H.® 24

Short pot-life curing agent on basis of triethylenetetramine (TETA).

 Curing Agents and Hardeners (Modified-) Amine Curing Agent 24 19.5 – 22.5 25 D.E.R. 331 LAA, NAA –
D.E.H.® 26

Similar to D.E.H. 24 Epoxy Curing Agent in application, it provides lower vapor hazard to workers due to its higher boiling point.

 Curing Agents and Hardeners (Modified-) Amine Curing Agent 27 50 – 60 27 D.E.R. 331 LAA, NAA –
D.E.H.® 29

Economical mixture of linear, branched, and cyclic ethylene amines that offers higher flexibility and peel strength in applications where color is not a limitation.

 Curing Agents and Hardeners (Modified-) Amine Curing Agent 29 200 – 300 24 D.E.R. 331 LAA, NAA –
D.E.H.® 39

Fast curing amine hardener based on amino-ethyl piperazine. Mostly used as accelerator for other curing agent.

 Curing Agents and Hardeners (Modified-) Amine Curing Agent 43 10 – 15 27 D.E.R. 331 LAA, NAA –
D.E.H.® 52

Viscous, room temperature curing agent that has a short pot life and convenient handling and mixing rates with liquid epoxy resins.

 Curing Agents and Hardeners – 42 – 47 5,000 – 7,500 18 D.E.R. 331 APAC, LAA, NAA –
D.E.H.® 58

Room-temperature, low viscosity curing agent that is extremely reactive with liquid epoxy resins.

 Curing Agents and Hardeners (Modified-) Amine Curing Agent 28 – 32 85 – 130 15 D.E.R. 331 APAC, LAA, NAA –